A Modular Design of the Lateral Information Propagation Neural Networks

용이한 확장을 위한 측방향정보전파 신경회로망의 모듈라 설계

  • Kim, Sung-Won (Dept. of Electrical Engineering Chonbuk National Univ.) ;
  • Kim, Hyong-Suk (School of Electrical Engineering, Chonbuk National Univ.)
  • 김성원 (전북대학교 전기공학과) ;
  • 김형석 (전북대학교 전기전자제어공학부)
  • Published : 1998.07.20

Abstract

The modular Lateral Information Propagation Networks(LIPN) has been designed. The LIPN has shown to be useful for interpolation of information[3]. The problem is the fact that only the small number of nodes can be implemented in a IC chip with the circuit VLSI technology. The proposed modular architecture is for enlarging the neural network through inter module connections. For such inter module connections, the host(computer or logic) mediates the exchange of information among modules. Also border nodes in each module have capacitors for temporarily retaining the information from outer modules. The LIPN with $4{\times}4$ modules has been designed and simulation of interpolation with the designed LIPN has been done.

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