Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Numerical Study on the Thermal Response of Electronics Assemblies During Infrared Reflow Soldering

적외선 Reflow 납땜과정중 전자조립품의 열적반응 수치해석

  • 손영석 (동의대학교 기계공학과)
  • Published : 1997.10.01
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