한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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경화제 함량과 후기경화조건에 따른 DGEBA/MDA/SN계의 절연열화 특성

Effects of Curing Agent Content and Post-curing Conditions on Dielectric Deterioration Characteristics of DGEBA/MDA/SN System

  • 조영신 (서울시립대학교 화학공학과) ;
  • 박수길 (충북대학교 공업화학과) ;
  • 임기조 (층북대학교 전기공학과) ;
  • 심미자 (서울시립대학교 생명과학과) ;
  • 김상욱 (서울시립대학교 화학공학과)
  • 발행 : 1997.11.01
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초록

The effects of aromatic curing agent of MDA contents and post curing conditions on dielectric deterioration characteristics of DGEBA/MDA/SN system were investigated. The dielectric properties were measured by using needle-plane electrode geometry under the commercial AC high electric field application. As the curing agent content increased, the dielectric breakdown strength increased and then decreased slightly. All the trees initiated from the tip of needle electrode and the shape of the tree in this system was a dendrite type.

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