Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1997.04a
- /
- Pages.293-296
- /
- 1997
A study on the electric breakdown of polyimide thin film fabricated by vapor deposition polymerization
진공증착중합법에 의해 제조된 폴리이미드박막의 절연파괴특성
Abstract
The experimental system used for vapor deposition polymerization (VDP) from PMDA (Pyromellitic dianhydride) and DDE (4, 4-diaminodiphenyl ether) were changed to PI (polyimide) thin films by thermal curing. The curing temperatures were 20
Keywords