Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1996.05a
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- Pages.121-121
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- 1996
Study on the thermal stability of interposed Ta/Cr bilayer diffusion barrier between Cu and Si
Cu와 Si사이에 도입된 Ta/Cr이중층 확산방지막의 열적안정성에 관한 연구
Abstract
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