Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1996.05a
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- Pages.220-223
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- 1996
A Study on PECVD Silicon Nitride Thin Films for IC Chip Packaging
IC 칩 패키지용 PECVD 실리콘 질화막에 관한 연구
Abstract
Mechanical properties of Plasma-Enhanced Chemical Vapor Deposited (PECVD) silicon nitride thin film was studied to determine the feasibility of the film as a passivation layer over the aluminum bonding areas of integrated circuit chips. Ultimate strain of the films in thicknesses of about 5 k
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