한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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- Pages.154-157
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- 1996
진공증착중합법에 의해 제조된 PMDA/4,4′-DDE 폴리이미드의 내열 특성
Heat resistant characterization of PMDA/4,4`-DDE polyimide of fabricated by vapor deposition polymerization
초록
The thin films are fabricated by VDPM and its heat resistant characteristics are investigated using Thermogravimetry. About polyimide, there is a wide difference between 5% weight loss temperature of TG curve and 20,000hr. of life time by methode of ASTM D2307. Therefore, TGI can be obtained by thermogravimetric analysis of NEMA std. pub. NOREI-1974. The TGI was got 670, 674 and 585 at 20
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