Shape reconstruction of solder joints on PCB using laminography

라미노그라피를 이용한 전자회로기판의 납땜부 형상 복원

This paper is aimed to develop a very reliable method for automatic inspection of the solder joints on PCBS. There have been lots of previous works using vision technologies, but they can not be used for inspecting BGA, FCA or other newly used devices. Thus we adopt X-ray technologies for solder joint inspection. We put our attention on reconstructing the 3D shapes of solder joints since it gives us the most detailed information on quality of solder joints. Laminography principle is used to reject the interferences from neighboring parts or leads. To verify the effectiveness of laminography, a simulation study is performed in the case of a solder joints on double sided PCB using.