A Study on the In-process Measurement of Metallic Surface roughness in Cylindrical Grinding by Diode Laser

원통연삭가공시 반도체 레이저 빔을 이용한 금속표면거칠기의 인프로세스 측정

This paper proposed a simple method for measuring surface roughness of ground surface. utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens a detecting unit with polygon mirror and CCD array sensor. and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultanilusly monitor the state of the grind wheel. The experimental results, showed that the increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min. the feed rate is 0.2m/min-0.9m/min, the dressing speed is 0.2mm/rev-0.4mm/rev, the stylus method and the in-process method can be obtained the same results. thus under limited working conditions. using the proposed system. the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.