대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1995년도 하계학술대회 논문집 C
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- Pages.1419-1421
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- 1995
정전형 마이크로 릴레이용 Ni 후막 구조체의 제조공정
Fabrication process of nickel structures for a electrostatic micro relay
- 이종현 (한국전자통신연구소, 반도체연구단) ;
- 박경호 (한국전자통신연구소, 반도체연구단) ;
- 이용일 (한국전자통신연구소, 반도체연구단) ;
- 최부연 (한국전자통신연구소, 반도체연구단) ;
- 이재열 (한국전자통신연구소, 반도체연구단) ;
- 최상수 (한국전자통신연구소, 반도체연구단) ;
- 유형준 (한국전자통신연구소, 반도체연구단)
- Lee, J.H. (ETRI, Semiconductor Division) ;
- Park, K.H. (ETRI, Semiconductor Division) ;
- Lee, Y.I. (ETRI, Semiconductor Division) ;
- Choi, B.Y. (ETRI, Semiconductor Division) ;
- Lee, J.Y. (ETRI, Semiconductor Division) ;
- Choi, S.S. (ETRI, Semiconductor Division) ;
- You, H.J. (ETRI, Semiconductor Division)
- 발행 : 1995.07.20
초록
Nickel micro-structures are fabricated by electroless plating which shows better uniformity. Positive resist AZ4562 of 7 um thickness is patterned with minimum width of 2 um on poly-silicon as for sacrificial layer. The growth rate of Ni electroless plating is 10um/h both for the seed layer of Pt and TiW. TiW is found to be more practical than Pt, since it is very difficult to remove Pt with negligible damage to Ni structures.
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