Proceedings of the Acoustical Society of Korea Conference (한국음향학회:학술대회논문집)
- 1994.06a
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- Pages.824-829
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- 1994
HIGH-FREQUENCY AND COMPLEX VIBRATION ULTRASONIC WIRE BONDING SYSTEMS
- Jiromaru Tsujino (Faculty of Engineering Kanagawa University) ;
- Tetsugi Ueoka (Faculty of Engineering Kanagawa University) ;
- Takahiro Mori (Faculty of Engineering Kanagawa University) ;
- Koichi Hasegawa (Faculty of Engineering Kanagawa University) ;
- Daisuke Kadota (Faculty of Engineering Kanagawa University)
- Published : 1994.06.01
Abstract
High-frequency and complex vibration ultrasonic wire bonding systems are propsed and their welding characteristic are studied. Ultrasonic wire bonding is used widely for joining thin connecting wire of various electronic devices including IC or LSI. Conventional bonding systems use vibration frequency of 40 or 60 kHz and linear vibration welding tips. Complex vibration welding tip which vibrates in elliptical to circular or rectangular to square in the same or different frequency is effective to join welding specimens in shorter welding time and under smaller vibration amplitude, and furthermore high-frequency systems such as 90, 120, 190 kHz are also significantly effective. High-frequency and complex vibration welding system of 90, 120 and 190 kHz are designed. Welding characteristics of these systems are found very superior than a conventional system. Welding specimens of aluminum wire of 0.1mm diameter are successfully.
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