Properties of the oxynitride films prepared by reoxidation of thermal oxide in $N_2O$

$N_2O$ 가스에서 열산화막의 재산화에 의해 형성된 oxynitride막의 특성

Electricial characteristics of gate dielectrics prepared by reoxidation of thermal $SiO_2$ in nitrous oxide gas have been investigated. 10 and 19nm-thick oxides were reoxidized at temperatures of $900-1000^{\circ}C$ for 10-60 min in $N_2O$ ambient. As reoxidation proceeds, it is shown that nitrogen concentration at $Si/SiO_2$ interface increases gradually through the AES analysis. Nitrogen pile-up at $Si/SiO_2$ interface acts as a oxidant diffusion barrier that reduces the oxidation rate significantly. And it not only strengthen oxynitride structure at the interface but improve the gate dielectric qualities. Reliabilities of oxynitride films are conformed by the breakdown distributions and constant current stress technique. Therefore, the oxynitride films made by this process show a good promise for future ULSI applications.