Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1993.11a
- /
- Pages.131-133
- /
- 1993
The Dielectric Properties of Hexamethyldisiloxane Thin Films by Plasma Polymerization
플라즈마 중합법에 의한 Hexamethyldisiloxane 박막의 유전특성
Abstract
Plasma polymerized thin films were prepared using an interelectrode capacitively coupled gas flow type reactor. Hexamethyldisiloxane was chosen as the monomer to be used. The dielectric properties of the thin films have been investigated with the changes of discharge power, heat treatment temperature and frequency. The relative dielectric constant was increased with an increasing of discharge power, but was decreased with an increasing of heat treatment temperature.
Keywords