• Title/Summary/Keyword: slurry

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Analysis of the Spreading uniformity of House Slurry Spreader (호스지표살포기의 살포균일도 분석)

  • 오인환
    • Journal of Animal Environmental Science
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    • v.6 no.1
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    • pp.37-44
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    • 2000
  • A new hose slurry spreader with improved spreading uniformity is developed to distribute the slurrynear to the soil surface and to reduce odor problems. The precision of distributed slurry was investigated using 3 types of slurry and found to be dependent on the rotor speed. For the solid matter separated fluid containing 0.1% of dry matter rotor speed of 150 rpm showed best uniformity with CV of 10% In the case of slurry from dairy cattle which contains 8.2% of dry matter high rotor speed of 330 rpm showed best result with CV of 7.2% Also swine slurry which has a 13.6% of dry matter content showed the best result of 8.1% CV at the high rotor speed of 250rpm. A high rotor speed generates enough pressure in the central distributor and as a result uniform distribution of slurry can be achieved. In conclusion it is highly recommended rotor speed of 300 rpm to get the best performance.

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A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • pp.1267-1268
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2,CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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Influences of Magnetic Field on Injection Time of Ferrite Slurry (자기장이 페라이트 슬러리의 주입시간에 미치는 영향)

  • Im, Jong-In;Yook, Young-Jin;Lee, Young-Jin
    • Journal of the Korean Ceramic Society
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    • v.43 no.12
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    • pp.829-832
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    • 2006
  • In this study, the influence of the magnetic field on ferrite slurry's injection time during the slurry forming process was investigated. The evaluation system of the slurry's injection time under the strong magnetic field was designed with FEM and manufactured. Studied parameters were the applied magnetic field, the input pressure of the slurry, and the supplying tube materials. As the results, the injection time was increased with the external magnetic field strength and rapidly decreased with increasing the input pressure of the slurry. Also the injection time was decreased when the supplying tube was manufactured with the magnetic material having the higher magnetic permeability than the ferrite.

A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • pp.1727-1728
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by do-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • pp.601-602
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$,$CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

  • PDF

A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • pp.2233-2234
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

  • PDF

A Study on the Oxide CMP Characteristics of using Mixed Abrasive Slurry(MAS) (혼합 연마제 슬러리를 이용한 Oxide CMP 특성에 관한 연구)

  • Lee, Sung-Il;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • pp.2235-2236
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry(MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$,and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing

  • Cho, Kyu-Chul;Jeon, Hyeong-Tag;Park, Jea-Gun
    • Korean Journal of Materials Research
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    • v.16 no.5
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    • pp.308-311
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    • 2006
  • The purpose of this study is to investigate the difference of the wafer nanotopography impact on the oxide-film thickness variation between the STI CMP using ceria slurry and STI CMP using fumed silica slurry. The nanotopography impact on the oxide-film thickness variation after STI CMP using ceria slurry is 2.8 times higher than that after STI CMP using fumed silica slurry. It is attributed that the STI CMP using ceria slurry follows non-Prestonian polishing behavior while that using fumed silica slurry follows Prestonian polishing behavior.

Viscosity Study to Optimize a Slurry of Alumina Mixed with Hollow Microspheres

  • Bukhari, Syed Zaighum Abbas;Ha, Jang-Hoon;Lee, Jongman;Song, In-Hyuck
    • Journal of the Korean Ceramic Society
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    • v.52 no.6
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    • pp.403-409
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    • 2015
  • Porous alumina ceramics are involved in many industrial applications due to the exceptional properties of these products. This study addresses the preparation of porous alumina ceramics using hollow microspheres as a pore-forming agent and slip casting as a green-body-forming technique. A uniform distribution of pores is a basic requirement of a porous material. This study investigates three different slurry systems, i.e., as-prepared alumina slurry, alumina slurry electrostatically dispersed by hydrochloric acid (HCl), and slurry dispersed by the commercial dispersant 'Darvan C-N'. At a low viscosity, the hollow microspheres in the slurry tend to float, which causes a non-uniform pore distribution. To avoid this phenomenon, the viscosity of the slurry was increased to the extent that the movement of hollow microspheres ceased in the slurry. As a result, a uniform pore distribution was achieved.

Recycling Characteristics of Silica Abrasive Slurry (실리카 슬러리의 재활용 특성)

  • Park, Sung-Woo;Kim, Chul-Bok;Lee, Woo-Sun;Chang, Eui-Goo;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.723-726
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    • 2004
  • In this work, we have studied the CMP characteristics by mixing of original slurry and used slurry in order to investigated the possibility of recycle of used silica slurry. The removal rate and within-wafer non-uniformity (WIWNU) were measured as a function of different slurry composition. Also, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and the original slurry. Our experimental results revealed comparable removal rate and good planarity with commercial products.

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