• Title, Summary, Keyword: bonding performance

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Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging (초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험)

  • Kim, Ji Soo;Kim, Jong Min;Lee, Soo Il
    • Journal of Welding and Joining
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    • v.30 no.6
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    • pp.113-119
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    • 2012
  • Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

Studies on Bond Properties of Repair Materials (보수.보강재료의 부착 특성에 관한연구)

  • 김진선;김경원;한만엽;정영수;홍영균
    • Proceedings of the Korea Concrete Institute Conference
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    • pp.293-298
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    • 1995
  • This study experimentally evaluate the bonding performance of repair and strengthening materials. It is very important problem to justify bonding properties between repair and strengthening materials and old concrete. Many previous research and investigation showed that bonding strength of reinforcing materials determines the strengthening effect and the durability of repair work. Therefore, menifestation of bonding properties and the improvement of bonding performance of repair and strengthening materials are very important. In order to improve the perforamnce of repair work, it needs to investigate the behavior of bonding materials, such as stress distribution along the bonding area and the long term performance of the material. The target repair methods are steel plate addition technique and repair mortar method, and the test parameters studied in this paper include epoxy thickness, bonding surface texture, and bonding area.

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Bonding Strength of bonded Polymer Concrete on Cured Cement Concrete (경화된 콘크리트에 접착된 폴리머 콘크리트의 부착강도 특성)

  • 홍승호;권순민
    • Proceedings of the Korea Concrete Institute Conference
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    • pp.353-358
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    • 2001
  • The cement concrete pavements are designed twenty years of performance life in Korea. At the present time, some expressways have been elapsed seventy percent of performance life which are detecting local failures. The most repair methods using to repair failures are partial depth repair and full section repair. These methods are most important bonding strength between rapid curing materials and substrate concrete pavements. This study was performed to evaluate bonding strength of the composites section made of rapid curing material and substrate concrete pavements. The pull-out tester was used to test bonding strength for the composites section made of each materials. In the results of the test, the bonding strength values of the epoxy mortar and acrylic mortar are higher than those of the other materials. The performance life of repaired section is affected by various factor. The bonding strength of bonded composites section may be affect the performance life, significantly.

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Cu-SiO2 Hybrid Bonding (Cu-SiO2 하이브리드 본딩)

  • Seo, Hankyeol;Park, Haesung;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.1
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    • pp.17-24
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    • 2020
  • As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO2 hybrid bonding.

Investigation of the Optimal Cooling Performance Using Peltier Module and Heat Sink (펠티에 소자 및 히트싱크를 이용한 최적 냉각성능에 관한 연구)

  • Lee, Dong-Ryul
    • Journal of the Korea Society For Power System Engineering
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    • v.10 no.4
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    • pp.65-70
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    • 2006
  • This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

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A Study on the Improvement of High Temperature Bonding Performance of LCD Panel Bonding Equipment (LCD 패널 압착장비의 고온압착성능 개선에 관한 연구)

  • Hwang, Il-Kwon;Kim, Dong-Min;Chae, Soo-Won
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.12
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    • pp.84-91
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    • 2010
  • The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

Performance of Adhesives for Bonding Fresh Concrete to Hardened Concrete under Application Conditions (신ㆍ구 콘크리트 접착제의 시공조건에 따른 성능)

  • 이찬영;심재원
    • Proceedings of the Korea Concrete Institute Conference
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    • pp.513-518
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    • 2002
  • In vertical construction joint, adhesives such as epoxy, acrylic, latex, etc. have been usually used for bonding fresh concrete to hardened concrete. In this study, performance of adhesives under various application conditions was investigated through tests for slant shear and flexural strength. From the results of the tests, it is found that superior bonding performance can be obtained under good surface preparation without adhesive when high strength concrete is used.

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A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617 (인코넬 617을 이용한 고온고압용 미세채널 열교환기의 확산접합 공정에 관한 연구)

  • Song, Chan Ho;Yoon, Seok Ho;Choi, Joon Seok
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.2
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    • pp.87-93
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    • 2015
  • Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.

Bonding Performance of Adhesives with Lamina in Structural Glulam Manufactured by High Frequency Heating System

  • Kim, Keon-Ho;Kim, Se-Jong;Yang, Sang-Yun;Yeo, Hwanmyeong;Eom, Chang-Deuk;Shim, Kugbo
    • Journal of the Korean Wood Science and Technology
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    • v.43 no.5
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    • pp.682-690
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    • 2015
  • The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging (전력반도체 접합용 천이액상확산접합 기술)

  • Lee, Jeong-Hyun;Jung, Do-hyun;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.9-15
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    • 2018
  • This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.