• Title/Summary/Keyword: Stress analysis

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다 span변단면주 산형가구의 실용해에 관한 연구

  • Ham, Seong-Gwon
    • Korean Architects
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    • no.11 s.82
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    • pp.22-25
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    • 1975
  • The aim of this study is the introduction of simplified method for the design stress analysis of multi-span gable frame structures with crane supports. Under the author's assumptions made previously for the same structures of single span, simplified stress analysis and exact computer analysis are excuted for some multi-span sample structures. Comparing the results of both stress analysis and with some modifications, a feasible simplified method for the design stress analysis of multi-span gable frame structures with crane supports is established.

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Stress Analysis of Pressure Vessels in Nuclear Power Plants (Part II : Stress Analysis of Tapered Cylinder in the Shell-Head Junction) (원자로압력용기의 응력해석 (제 2 보, 원데이퍼진 원통부의 응력해석))

  • 김천욱;주영우
    • Journal of the KSME
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    • v.16 no.2
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    • pp.100-107
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    • 1976
  • Stress analysis of tapered cylinder of reactor vessels is investigated by means of the intersection method. The tapered cylinder is approximated into three models-average cylinder, conical frustum, and ring. The results are compared with those of the finite element method program and an experiment. In this paper, the following results are obtained: (1) the best aproximation has been obtained by the ring model analysis: (2) the intersection analysis of the tapered cylinder by the ring model shows a sufficient accuracy for the stress analysis of reactor vessels.

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Experimental Stress Analysis with Reflection Polariscope (반사시 광탄성 실험기를 이용한 실험응력 해석)

  • Byeon, Hui-Mun;Lee, Sun-Bok
    • 한국기계연구소 소보
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    • s.10
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    • pp.11-20
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    • 1983
  • Photoelasticity is an experimental technique for stress and strain analysis that is particularly useful for members having complicated geometry, complicated loading conditions, or both. The principle and engineering applications of photoelastic stress analysis are briefly reviewed. Experimental stress analysis with Reflection Polariscope at KIMM Structural Mechanics Laboratory was applied to the following practices: Stress analysis of the crosshead of the structural fatigue testing machine; Experimental safety verification of domestic excavator.

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Thermal stress analysis around a cavity on a bimetal

  • Baytak, Tugba;Bulut, Osman
    • Structural Engineering and Mechanics
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    • v.69 no.1
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    • pp.69-75
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    • 2019
  • The plates made of two materials joined to each other having the different coefficient of thermal expansions are frequently encountered in the industrial applications. The stress analysis of these members under the effect of high-temperature variation has great importance in design. In this study, the stress analysis of the experimental model developed for the problem considered here was performed by the method of photothermoelasticity. The thermal strains were formed by the mechanical way and these were fixed by the strain freezing method. For the stress measurements, the method of slicing is applied which provides three-dimensional stress analysis. The analytical solution in the literature was compared with the related stress distribution obtained from the model. Moreover, the axisymmetric finite element model developed for the problem was solved by ABAQUS and the results obtained here compared with those of the experimental model and the analytical solution. As a result of this study, this experimental method and numerical model can be used for these type of thermal stress problems which have not been comprehensively analyzed yet.

Development of Residual Stress Analysis Procedure for Fitness-For-Service Assessment of Welded Structure (용접 구조물의 사용중 적합성 평가를 위한 잔류응력 해석절차 개발)

  • Kim, Jong-Sung;Jin, Tae-Eun;P. Dong;M. Prager
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.5
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    • pp.713-723
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    • 2003
  • In this study, a state of art review of existing residual stress analysis techniques and representative solutions is presented in order to develope the residual stress analysis procedure for fitness-for-service (FFS) assessment of welded structure. Critical issues associated with existing residual stress solutions and their treatments in performing FFS are discussed. It should be recognized that detailed residual stress evolution is an extremely complicated phenomenon that typically involves material-specific ther-momechanical/metallurgical response, welding process physics, and structural interactions within a component being welded. As a result, computational procedures can vary significantly from highly complicated numerical techniques intended only to elucidate a small part of the process physics to cost-effective procedures that are deemed adequate for capturing some of the important features in a final residual stress distribution. Residual stress analysis procedure for FFS purposes belongs to the latter category. With this in mind, both residual stress analysis techniques and their adequacy for FFS are assessed based on both literature data and analyses performed in this investigation.

Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

Staged Finite Element Modeling with Coupled Seepage and Stress Analysis

  • Lee, Jae-Young
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.23 no.6
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    • pp.703-714
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    • 2010
  • This paper proposes an approach for staged finite element modeling with coupled seepage and stress analysis. The stage modeling is based on the predefined inter-relationship between the base model and the unit stage models. A unit stage constitutes a complete finite element model, of which the geometries and attributes are subject to changes from stage to stage. The seepage analysis precedes the mechanical stress analysis at every stage. Division of the wet and dry zone and the pore pressures are evaluated from the seepage analysis and used in determining input data for the stress analysis. The results of the stress analysis may also be associated with the pore water pressures. For consolidation analysis, the pore pressure and the displacement variables are mixed in a coupled matrix equation. The time marching solution produces the dissipation of excess pore pressure and variation of stresses with passage of time. For undrained analysis, the excess pore pressures are computed from the stress increment due to loading applied in the unit stage and are used in revising the hydraulic head. The solution results of a unit stage are inherited and accumulated to the subsequent stages through the relationship of the base model and the individual unit stages. Implementation of the proposed approach is outlined on the basis of the core procedures, and numerical examples are presented for demonstration of its application.

Thermal Stress Analysis for a Brake Disk considering Pressure Distribution at a Frictional Surface (마찰면의 압력 분포를 고려한 제동디스크의 열응력 해석)

  • Lee Y.M.;Park J.S.;Seok C.S.;Lee C.W.;Kim J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.842-846
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    • 2005
  • A brake disk and a pad are important parts that affect the braking stability of a railway vehicle. Especially, because a brake disk stops the vehicle using conversion of the kinetic energy to frictional energy, thermal fatigue cracks are generated by the cyclic thermal load, as frictional heat, on a frictional surface and these cracks cause the fracture of a brake disk. Therefore, many researches for the thermal stress must be performed to improve the efficiency of brake disk and ensure the braking stability. In this study, we performed the thermal stress analysis for a ventilated brake disk with 3-D analysis model. For that, we simplified the shape of a ventilated hole to minimize problems that could be occurred in analysis process. Thermal stress analysis was performed in case that pressure distributions on a frictional surface is constant and is not. To determine pressure distributions of irregular case, pressure distribution analysis for a frictional surface was carried out. Finally using the results that were obtained through pressure distribution analysis, we carried out thermal stress analysis of each case and investigated the results of thermal stress analysis.

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Die Design for the Hot Extrusion with TiB$_2$Insert (TiB$_2$ 인서트를 체결한 열간압출 금형설계 및 제작)

  • Kwon, Hyuk-Hong;Lee, Jung-Ro
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.9
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    • pp.118-124
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    • 2002
  • The use of ceramic inserts in hot extrusion dies offers significant technical and economic advantages over other forms of manufacture. In this paper, process simulation and stress analysis are thus combined during the design, and a data exchange program has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process. The shrink fit analysis has been performed that enables optimal design of the dies taking into account the elastic deflections which generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the die design. The stress analysis of the dies is used to determine the stress conditions on the ceramic insert by considering contact and interference effects under both mechanical and thermal loads. The results are compared with the experimental ones for verification.

Stress Analysis of the S-CVT using Finite Element Method (FEM을 이용한 구체무단변속기의 응력해석)

  • Kim, J.Y.
    • Journal of Power System Engineering
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    • v.12 no.2
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    • pp.41-47
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    • 2008
  • This article deals with the stress analysis of the friction drive, which transmits the power via the rolling resistance on the contract area between the two rotating bodies. On the contact area, friction drives are normally involved with shear stress due to the transmitted force, as well as normal stress. Thus the stress analysis including the shear stress is necessary for the design of the friction drive. Hertzian results can be used to estimate the normal stress distribution and elastic deflection of the contact area, although the shear stress distribution is not well defined. In order to investigate the shear stress distribution and its effects in a friction drive, we have performed the stress analysis of the spherical continuously variable transmission(CVT) using finite element method. The spherical CVT is one of friction drives, which is used in small power applications. The numerical results show that the normal stress distribution is not affected by the transmitted shear force, and the maximal shear stress is increased in small amount along with the shear force.

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