• Title, Summary, Keyword: Slurry

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Effect of Slurry Flow in Spray Slurry Nozzle System on Cu CMP (스프레이 슬러리 노즐 시스템에서 슬러리 유동이 Cu CMP에 미치는 영향)

  • Lee, Da Sol;Jeong, Seon Ho;Lee, Jong Woo;Jeong, Jin Yeop;Jeong, Hae Do
    • Journal of the Korean Society for Precision Engineering
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    • v.34 no.2
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    • pp.101-106
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    • 2017
  • The chemical mechanical planarization (CMP) process combines the chemical effect of slurry with the mechanical effect of abrasive (slurry)-wafer-pads The slurry delivery system has a notable effect on polishing results, because the slurry distribution is changed by the supply method. Thus, the investigation of slurry pumps and nozzles with regard to the slurry delivery system becomes important. This paper investigated the effect of a centrifugal slurry pump on a spray nozzle system in terms of uniform slurry supply under a rotating copper (Cu) wafer, based on experimental results and computational fluid dynamics (CFD). In conventional tools, the slurry is unevenly and discontinuously supplied to the pad, due to a pulsed flow caused by the peristaltic pump and distributed in a narrow area by the tube nozzle. Adopting the proposed slurry delivery system provides a higher uniformity and lowered shear stress than usual methods. Therefore, the newly developed slurry delivery system can improve the CMP performance.

Additive Effect in the Preparation of Carbon-slurry Fuel (Carbon-slurry 연료의 제조에 있어서 첨가제의 효과)

  • Cho, Min-Ho;Lee, Dae-Yeop;Han, Jeong-Sik;Lee, Ik-Mo
    • Applied Chemistry for Engineering
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    • v.18 no.1
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    • pp.64-70
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    • 2007
  • Preparation and characterization of carbon-slurry fuel with high dispersion have been carried out. Carbon-slurry fuel was obtained by mixing Jet A-1 liquid fuel with appropriate carbon powders and additives. Dispersion of carbon in Jet A-1 was affected by various factors such as mixing temperature, characteristics of carbon powders, and type and amount of additives. Among these factors, the stability of the slurry fuel was most dependent on the type of additive. A variety of additives such as anionic, cationic, and nonionic additives was tested for the dispersion of carbon in Jet A-1. It was found that anionic additives based on sodium salts showed the highest dispersion of carbon-slurry fuels. The degree of dispersion could be monitored by measuring the luminosity.

Methodological Study for Recycle of Chemical Mechanical Polishing Slurry (슬러리 Modification 에 대한 연구)

  • Park, Sung-Woo;Seo, Yong-Jin;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.567-568
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    • 2006
  • To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina ($Al_2O_3$) powder as an abrasive added within DSS were evaluated to achieve the improvement of removal rates (RRs) and within-wafer non-uniformity (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate the possible ways of reusing it. And then, we have discussed the CMP characteristics of silica slurry retreated by mixing of original slurry and used slurry (MOS).

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Polishing Properties by Change of Slurry Temperature in Oxide CMP (산화막 CMP 공정에서 슬러리 온도 변화에 따른 연마 특성)

  • Ko, Pil-Ju;Park, Sung-Woo;Kim, Nam-Hoon;Seo, Yong-Jin;Lee, Woo-Sun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.3
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    • pp.219-225
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    • 2005
  • To investigate the effects of slurry temperature on the chemical mechanical polishing(CMP) performance of oxide film with silica and ceria slurries, we have studied slurry properties as a function of different slurry temperature. Also, the effects of each input parameter of slurry on the oxide CMP characteristics were investigated. The pH showed a slight tendency of decrease, the conductivity in slurries showed an increased tendency, the mean particle size in slurry decreased, and the zeta potential of slurry decreased with temperature. The removal rates significantly increased and maintained at the specific levels over 4$0^{\circ}C$. The better surface morphology of oxide films could be obtained at 40 $^{\circ}C$ of silica slurry and at 90 $^{\circ}C$ of ceria slurry. It is found that the CMP performance of oxide film could be significantly improved or controlled by change of slurry temperature.

Improvement of Mixed Abrasive Slurry (MAS) Characteristics According to the Abrasive Adding (연마제 첨가량에 따른 Mixed Abrasive Slurry (MAS)의 CMP 특성 고찰)

  • Lee, Sung-Il;Lee, Young-Kyun;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.380-381
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    • 2006
  • Chemical mechanical polishing (CMP) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, the cost of ownership and cost of consumables are relatively high because of expensive slurry. In this paper, we studied the mixed abrasive slurry (MAS). In order to save the costs of slurry, the original silica slurry was diluted by de-ionized water (DIW). And then, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry. We have also investigate the possibility of mixed abrasive slurry for the oxide CMP application.

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Numerical Analysis on the Flue Gas Flow and Slurry Behavior in the Absorber of a Flue Gas Desulphurization (FGD) System (배연탈황설비 흡수탑 내 연소가스 및 슬러리의 거동에 관한 수치해석적 연구)

  • Choi, Choeng-Ryul
    • Journal of Korean Society for Atmospheric Environment
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    • v.23 no.4
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    • pp.478-486
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    • 2007
  • Numerical analysis had been performed to understand flow characteristics of the flue gas and slurry in the absorber of a flue gas desulphurization (FGD) system using computational fluid dynamics (CFD) technique. Two-fluid(Euler-Lagrangian) model had been employed to simulate physical phenomenon, which slurry particles injected through slurry spray nozzles fall down and bump into the flue gas inflowing through inlet duct. It was not necessary to adopt pre-defined pressure drop inside the absorber because interaction between flue gas and slurry particles was considered. Hundreds of slurry spray nozzles were considered with the spray velocity at the nozzles, swirl velocity and spreading angle. The results note that the flow disturbance of flue gas is found at the bottom of the absorber, and the current rising with high speed stream is observed in the opposite region of the inflow duct. The high speed stream is reduced as the flue gas goes up, because the high speed stream of flue gas dumps falling slurry particles due to momentum exchange between flue gas and slurry particles. In spite of some disproportion in slurry distribution inside the absorber, escape of slurry particles from the absorber facility is not observed. The pressure drop inside the absorber is mainly occurred at the bottom section.

Effect of Anionic Polyelectrolyte on Alumina Dispersions for Ru Chemical Mechanical Polishing

  • Venkatesh, R. Prasanna;Victoria, S. Noyel;Kwon, Tae-Young;Park, Jin-Goo
    • Proceedings of the Materials Research Society of Korea Conference
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    • pp.24.2-24.2
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    • 2011
  • Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

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Reliability Evaluation of a Slurry Pump (슬러리 펌프의 신뢰성 향상)

  • Jung, Dong Soo
    • Journal of Applied Reliability
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    • v.16 no.4
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    • pp.263-271
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    • 2016
  • Purpose: A slurry pump for flue gas desulfurization system performs a role that discharges the slurry of a plaster shape in a thermal power plant. Since a slurry pump transfers the slurry by the centrifugal force, it has the friction wear in the impeller and liner because of the slurry. Methods: In this study, failure analysis and test evaluation on the slurry pump have been proposed and the process that reliability of the product improves through design improvement has been presented. And failure cause of typical failure case has been investigated and improvement design has been presented. Results: Reliability improvement is established by analysis of the test results of before and after acceleration test. Conclusion: This study can be provided to improve the product reliability through failure analysis of a slurry pump.

Environmental Impact of Concentration of Slurry Components in Thick Copper CMP

  • Lee, Hyunseop
    • International Journal of Precision Engineering and Manufacturing-Green Technology
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    • v.4 no.1
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    • pp.13-18
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    • 2017
  • Chemical mechanical polishing (CMP) is the dirtiest semiconductor process using a slurry containing chemicals and abrasives. CMP process consumes a huge amount of slurry, which affects environmental sustainability negatively. The semiconductor industry has attempted to evaluate and reduce the carbon dioxide equivalent (CDE) for environmental sustainability. In this study, the environmental impact of the concentration of the slurry components in CMP of thick copper films is investigated. The selected slurry components for copper CMP are citric acid, hydrogen peroxide ($H_2O_2$), abrasive, and benzotriazole (BTA). The carbon intensity of each slurry component is estimated from previously reported studies. During the experiments, the material removal rates (MRRs) are measured for various compositions of the slurry. The CDE is obtained by measuring electric energy, slurry, and ultrapure water (UPW) consumptions. We find that citric acid and BTA positively and negatively influence the CDE, respectively. Further, 2 wt.% of $H_2O_2$ and 4 wt.% of abrasive result in the lowest values of the CDE in thick copper CMP.

Trends and Constraints of Grain Slurry Food Processing in Kaduna State, Nigeria

  • Dolapo, Oloyede O.;Shittu, Sarafadeen K.;Kayode, Fadele O.
    • Journal of Biosystems Engineering
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    • v.41 no.2
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    • pp.93-97
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    • 2016
  • Purpose: Grain slurry diet are described as food obtained from ground grain paste. They serve as highly nutritious food for both adults and infants in Nigeria because of their immense nutritive and economical value. However, the production of these grain slurry diets is confronted with challenges that have hampered their commercialization. This study examines the trends and constraints of grain slurry food processing in Kaduna State. Methods: A survey was conducted using a structured questionnaire to elicit information from 192 selected processors, including both men and women. The survey was structured in line with the study objectives. The information was collated and synopsized into frequency distribution. Results: These findings revealed that 80% of the respondents processed between 1.0 tons and 13.0 tons of grain slurry per month. More than 90% of the processors processed grain slurry into koko, kunu, agidi, and pito. Accordingly, 80% of the interviewed processors indicated that sieving is one of the major constraints. Furthermore, inadequate modern machinery required to perform this operation makes it highly discouraging. One of the major challenges faced by the grain slurry producers in Nigeria is the lack of processing machinery for most operations (39.1%), followed by the tedious processing nature (27.1%), high labor cost (18.1%), and lack of market (9.4%). The traditional method of grain slurry processing was more popular than using modern equipment, except milling (96.5%), which is the only mechanized unit operation in grain slurry processing. Conclusion: Grain slurry processing and marketing were found to be profitable. However, these limitations could extremely reduce the level of grain slurry production, processing, and economic returns, thereby affecting the general wellbeing of the processors. The study also raised concerns about the safety and hygiene associated with traditionally processed grain slurry diets in the investigated areas.