• Title, Summary, Keyword: Plating

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Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH

  • Nishiki, Shingo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.39-43
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    • 2012
  • Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

Effect of Plating Condition and Surface on Electroless Co-Cu-P Alloy Plating Rate (무전해 Co-Cu-P 도금속도에 미치는 도금 조건과 표면상태의 영향)

  • Oh, L.S.
    • Journal of Power System Engineering
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    • v.4 no.2
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    • pp.31-39
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    • 2000
  • Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.

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The Surface Improvement by Supercritical Nano Plating (슈퍼크리티컬 나노 플레이팅에 의한 표면개질)

  • Kim, Yun-Hae;Bae, Chang-Won;Kim, Do-Wan;Moon, Kyung-Man;Kim, Dong-Hun;Jo, Young-Dae;Kang, Byung-Yoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.9
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    • pp.913-921
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    • 2009
  • In this study, supercritical nano plating was performed to observe its effect on materials. Using supercritical carbon dioxide as a solvent, we observed how different pressures and temperatures of the supercritical fluid affected the process and its outcome. The plating current increases as pressure increases from 8 MPa to 16 MPa, but it decreases after that. Similarly, the plating current increases as temperature is increased from $35^{\circ}C$ to $45^{\circ}C$, but the current decreases after that. Also, the thickness of the wet electrolyte plating is about $35\sim50{\mu}m$, while the thickness of the plating done using supercritical fluid is about $20\sim25{\mu}m$. At the results, It to it is considered that supercritical nano plating enable to form more thin and stable plating than wet electroplating methods. Also both of the electroplating methods could be affected plating quality by surface condition, and the supercritical nano plating has been confirmed to product more uniform plating surface than wet electroplating.

INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY

  • Kwon, Sik-Chol;Baek, Woon-Sung;Lee, Gun-Hwan;Rha, Jong-Joo
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.253-256
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    • 1999
  • Wet plating has been initiated and developed as a major surface finishing technology as of the long customized and highly productive process until now. As the external compression by virtue of the environmental preservation becomes stricter, there has been new move to adapt dry plating line instead of conventional wet plating one in domestic surface finishing industry. Dry plating, so-called, plasma surface technology has been developed in semiconducting industry and becomes a key technology to be useful as an alternative to wet plating in surface finishing industry. The historical progress of domestic surface finishing industry was outlined with the background on the adaptation of three dry plating processes-plasma spraying, plasma nitriding and ion plating. The present status of domestic industrial activity was covered on major alternative to wet plating.

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Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Ni-Cu-P Deposits (무전해 Ni-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향)

  • Oh, I.S.;Lee, T.H.
    • Journal of Power System Engineering
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    • v.10 no.3
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    • pp.58-66
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    • 2006
  • The effect of bath composition, plating condition and plating rate on the magnetic properties of electroless Ni-Cu-P deposits were investigated. With increasing $CuSO_4$ concentration in the bath, plating rate increased, while the Br value of deposits decreased Sharply. Plating rate increased up to 34% with the addition of 200ppm of NaF and 0.8ppm of Thiourea to the bath. Plating reaction had been ceased by the increase of pH above 11.3, bath temperature higher than $90^{\circ}C$ and under $70^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent (Sodium citrate, Ethylenediamine) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer(Thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(120 min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

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The Supplement of Sn/Cu, Plating Solution Affects in Plating Skim Quality of the Plating Product (Sn/Cu 도금액의 보충이 도금제품의 도금피막특성에 미치는 영향)

  • Jeon, Taeg-Jong;Ko, Jun-Bin;Lee, Dong-Ju
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.7
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    • pp.112-119
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    • 2009
  • The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

Effect of Plating Conditions on Electroless Copper Plating on SiC Fabric (직조된 SiC 섬유에 무전해 구리도금 시 도금 조건의 영향)

  • Lee, Kee Hwan;Sohn, Youhan;Han, Taeyang;Lee, Kyung Jin;Kim, Hye Hung;Han, Jun Hyun
    • Journal of the Korean institute of surface engineering
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    • v.50 no.4
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    • pp.244-250
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    • 2017
  • Effects of plating conditions (dispersant concentration, plating time, and ultrasonication) on electroless Cu plating on SiC fabric woven by crossing of SiC continuous fibers vertically were studied. The ultrasonic dispersion treatment not only did not improve the dispersion of the SiC fibers, but also did not change the plating thickness. The ultrasonication in the pretreatment step of electroless plating did not improve the dispersion of the fibers, while the ultrasonication in the plating step enhanced the dispersion of the fibers and decreased the thickness of the Cu films. It was possible to control the thickness of the Cu coating layer as well as the dispersion of the fibers in the fabric by changing the plating conditions such as dispersant concentration, plating time, and ultrasonication, but it was very difficult to coat copper on the intersection of vertical fibers in the fabric.

Electroless Pd deposition on a planar porous stainless steel substrate using newly developed plating rig and agitating water bath

  • Seo, Beom-Seok;Han, Jae-Yun;Lee, Kwan-Young;Kim, Dong-Won;Ryi, Shin-Kun
    • Korean Journal of Chemical Engineering
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    • v.34 no.1
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    • pp.266-272
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    • 2017
  • A new plating bath was developed to prevent palladium plating in the pores of the porous stainless steel support when using plate-type porous substrate. The plating bath, composed of a holder, a rubber O-ring and a bottom, provides very simple assembly and is very effective in preventing palladium plating in the pores of porous stainless steel. The agitation of the plating solution increases plating rate significantly because the agitation improves the external mass transfer of Pd ion and reducing agent to the membrane surface facilitating ~99.7% plating yield of palladium ion. This new plating method carried out at a temperature range of 293 to 298 K provides a very simple and economic membrane manufacturing process. Using a newly developed plating rig, an 88.9-mm diameter membrane was fabricated, and gas permeation tests showed that the hydrogen permeation flux reached ${\sim}0.9mol\;s^{-1}m^{-2}$ at 873 K and a pressure difference of 300 kPa and selectivity ($H_2/N_2$) was ~1,850 at 873 K with a pressure difference of 100 kPa.

Review on Electroless Plating(I) (무전해도금(I))

  • Kim, Man;Kwon, Sik-Chol
    • Journal of the Korean institute of surface engineering
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    • v.19 no.3
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    • pp.121-127
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    • 1986
  • There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

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Electroless Ni Plating of Monodisperse Polymer Particles (단분산 가교 고분자 미립자의 무전해 니켈도금 연구)

  • Kim, Dong-Ok;Shon, Won-Il;Jin, Jeong-Hee;Oh, Seok-Heon
    • Polymer(Korea)
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    • v.31 no.3
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    • pp.184-188
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    • 2007
  • Monodisperse PMMA/HDDA polymer particles were coated via electroless Ni plating using sodium hypophosphite as a reducing agent in an acidic environment. In this study, the effects of 1) the pretreatment conditions, 2) the plating temperature, 3) the plating pH, and 4) the initial pH, control of plating bath on the variation of plating rate, surface state of plated particles and plating reproducibility were investigated. It was observed that every pretreatment steps, especially conditioning and acceleration step, were very important for obtaining uniform Ni plating and the plating rate was increased with the increase of plating temperature and pH. Moreover, the initial pH control of plating bath was critical for the plating reproducibility.