• Title, Summary, Keyword: Package

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Thermal Performance Analysis for Cu Block and Dense Via-cluster Design of Organic Substrate in Package-On-Package

  • Lim, HoJeong;Jung, GyuIk;Kim, JiHyun;Fuentes, Ruben
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.91-95
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    • 2017
  • Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

Improvement of Fully Coupled SWAT-MODFLOW Model (SWAT-MODFLOW 모형의 개선)

  • Kim, Nam-Won;Won, Yoo-Seung;Chung, Il-Moon
    • Proceedings of the Korea Water Resources Association Conference
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    • pp.743-748
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    • 2005
  • 김남원 등(2004a, b)에 의해 개발된 SWAT-MODFLOW 모형은 SWAT 모형과 MODFLOW 모형의 Recharge Package와 River Package를 직렬로 연결한 모형이다. 그러나 MODFLOW 모형에는 지하수 흐름방정식의 해석에 관련된 Package를 제외하더라도 Well, Drain, Evapotranspiration 등의 Package가 더 있어 대수층으로부터의 우물의 함양과 배출, 배수관을 통한 지하수의 배출, 지하수의 증발산으로 인한 손실 등을 수행할 수 있다. MODFLOW 모형의 Well Package는 SWAT 모형에서 대수층의 물이동, Drain Package는 SWAT 모형의 토관배수, Evapotranspiration Package는 SWAT 모형의 얕은 대수층에서의 증발산과 밀접한 관계가 있다. 본 연구에서는 이들 세 개의 Package를 SWAT 모형과 완전 연동시킴으로써 사용자가 좀 더 다양한 조건에 대하여 SWAT-MODFLOW 결합모형을 적용할 수 있도록 기능을 향상시켰다.

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Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test (온도/습도 시험, 온도 싸이클링 시험 및 고온유지 시험에 따른 Package-on-Package의 신뢰성)

  • Park, Donghyun;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.43-49
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    • 2016
  • Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

On the Development of 3D Finite Element Method Package for CEMTool

  • Park, Jung-Hun;Ahn, Choon-Ki;Kwon, Wook-Hyun
    • 제어로봇시스템학회:학술대회논문집
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    • pp.2410-2413
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    • 2005
  • Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

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A study on the Institutional Limits of Introducing the Package Express System to the Railway (기술혁신의 제도적 한계 - 철도소화물 부분의 택배시스템 도입을 중심으로 -)

  • 윤명길
    • Journal of Korea Technology Innovation Society
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    • v.3 no.3
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    • pp.1-17
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    • 2000
  • This paper shows the institutional limits of technological innovation at the railway package service, that is the limits of introducing the package express system. The railway package service, owned by government and operated by D company, has been suffered severe operating loss since early 1990's. The package express system supported by information network and co-working with inner city quick service might be an solution for the railway package service. But there are several obstacles such as labor union and the rigidities of the Korean National Railroad of government agency.

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THe Novel Silicon MEMS Package for MMICS (초고추파 집적 회로를 위한 새로운 실리콘 MEMS 패키지)

  • Gwon, Yeong-Su;Lee, Hae-Yeong;Park, Jae-Yeong;Kim, Seong-A
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.51 no.6
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    • pp.271-277
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    • 2002
  • In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

A Study on Localization Model of Package Usage in Ada Program (Ada 프로그램에서 패키지 활용의 국부화 모델에 관한 연구)

  • Kim Seon-Ho;Yun Chang-Seop
    • Journal of the military operations research society of Korea
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    • v.17 no.2
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    • pp.100-112
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    • 1991
  • Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.

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An Examples Development and Implementation of Core Skill-TLP Package in Patient Management (문제중심학습 개념의 환자관리 Core Skill-TLP 교육교재 개발 및 적용)

  • Lee, Young-Ah
    • The Korean Journal of Emergency Medical Services
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    • v.14 no.2
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    • pp.25-40
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    • 2010
  • Purpose : The purpose of this study was to develop and apply a Core Skill-TLP(Core Skill-Tutorial, Laboratory, Practicum) package in Patient Management and to effect of core skill-TLP education. Methods : This study was used to developed Patient Management' Core Skill-TLP package throughout 14 steps of Core Skill-TLP package development model. Then, Core Skill-TLP Learning methodology was implemented in first year student in the undergraduate emergency medical technology, and survey was done. Results : 1. Core Skill-TLP package model was presented based on conceptual model of PBL(S-PBL). 2, The student in OSCE did significantly better in clinical patient management core skills performance. 3. As to the satisfaction of Core Skill-TLP package management, student, tutor and self-satisfaction score was 3.21, 3.42, 3.38 respectively. Conclusion : This study was suggested that Core Skill-TLP education would be necessary with well-structured package and achieved advantage of simulation and PBL.

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Estimate on related to Chip Set and the other Various Parameter in Electronic Plastic Package (반도체 패키지의 칩셋과 다른 설계변수와의 연관성 평가)

  • Kwon, Yong-Su
    • Journal of the Korean Society of Industry Convergence
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    • v.2 no.2
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    • pp.131-137
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    • 1999
  • Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

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Applications of R statistical package on Probability and Statistics Education in Elementary, Middle and High School(I) (초.중.고등학교 확률 및 통계영역 교육에서의 R 통계패키지의 활용(I))

  • Jang, Dae-Heung
    • Communications of Mathematical Education
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    • v.21 no.2
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    • pp.199-225
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    • 2007
  • We can use R package as a statistical package on the education of probability and statistics in elementary, middle and high school mathematics. R is an interactive mode package and graphical presentation tools in R are powerful. The greatest advantage is that R is a general public license package. We need to consider R package as a standard statistical package on the education of probability and statistics in elementary, middle and high school mathematics.

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