• Title, Summary, Keyword: NCA

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Electrochemical Properties of Commercial NCA Cathode Materials for High Capacity of Lithium Ion Battery (상용 고용량 리튬이온이차전지용 NCA 양극활물질의 전기화학적 특성)

  • Jin, En Mei;Lee, Ga-Eul;Na, Byuong-Ki;Jeong, Sang Mun
    • Korean Chemical Engineering Research
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    • v.55 no.2
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    • pp.163-169
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    • 2017
  • In order to investigate the electrochemical properties and the particle size effect of $LiNi_{1-x-y}Co_xAl_yO_2$ (x=0.15, y=0.045 or 0.05, NCA) for lithium ion batteries (LIBs), two commercial NCA cathode materials (NCA#1, NCA#2) were used as cathode materials for LIB. The average particle size of the NCA#1 which consisted of uniform spherical particles was found to be approximately $5m{\mu}$. NCA#2 consisted of particles with bimodal size distribution of approximately $5m{\mu}$ and $11m{\mu}$. From the results of charge-discharge performance test, a high initial discharge capacity of 197.0 mAh/g was obtained with NCA#2, which is a higher value than that with NCA#1. The cycle retentions of NCA#1 and NCA#2 up to 30 cycles were 92% and 94%, respectively.

Enhanced Electrochemical Properties of NCA Cathode Materials for Lithium Ion Battery by Doping Effect (도핑효과에 따른 리튬이차전지용 NCA 양극활물질의 전기화학적 특성 향상)

  • Fan, Zhi Yu;Jin, n Mei;Jeong, Sang Mun
    • Korean Chemical Engineering Research
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    • v.55 no.6
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    • pp.861-867
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    • 2017
  • In order to improve the capacity and cycling stability of Ni-rich NCA cathode materials for lithium ion batteries, the boron and cobalt were doped in commercial $Li_{1.06}Ni_{0.91}Co_{0.08}Al_{0.01}O_2$ (NCA) powders. Commercial NCA particles are mixed composites such as secondary particles of about $5{\mu}m$ and $12{\mu}m$, and the particle size was decreased by doping boron and cobalt. The initial discharge capacities of the boron and cobalt doped NCA-B and NCA-Co were found to be 214 mAh/g and 200 mAh/g, respectively, which are higher values than that of the raw NCA cathode material. In particular, NCA-Co exhibits the best discharge capacity of 157 mAh/g after 20 cycles, which is probably due to the enhanced diffusion of lithium ion by crystal growth along with the c-axis direction.

Machine Learning Based Structural Health Monitoring System using Classification and NCA (분류 알고리즘과 NCA를 활용한 기계학습 기반 구조건전성 모니터링 시스템)

  • Shin, Changkyo;Kwon, Hyunseok;Park, Yurim;Kim, Chun-Gon
    • Journal of Advanced Navigation Technology
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    • v.23 no.1
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    • pp.84-89
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    • 2019
  • This is a pilot study of machine learning based structural health monitoring system using flight data of composite aircraft. In this study, the most suitable machine learning algorithm for structural health monitoring was selected and dimensionality reduction method for application on the actual flight data was conducted. For these tasks, impact test on the cantilever beam with added mass, which is the simulation of damage in the aircraft wing structure was conducted and classification model for damage states (damage location and level) was trained. Through vibration test of cantilever beam with fiber bragg grating (FBG) sensor, data of normal and 12 damaged states were acquired, and the most suitable algorithm was selected through comparison between algorithms like tree, discriminant, support vector machine (SVM), kNN, ensemble. Besides, through neighborhood component analysis (NCA) feature selection, dimensionality reduction which is necessary to deal with high dimensional flight data was conducted. As a result, quadratic SVMs performed best with 98.7% for without NCA and 95.9% for with NCA. It is also shown that the application of NCA improved prediction speed, training time, and model memory.

Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA (NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가)

  • Chung Seung-Min;Kim Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.13 no.2
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    • pp.21-26
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    • 2006
  • We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

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Failure in the COG Joint Using Non-Conductive Adhesive and Polymer Bumps (감광성 고분자 범프와 NCA (Non-Conductive Adhesive)를 이용한 COG 접합에서의 불량)

  • Ahn, Kyeong-Soo;Kim, Young-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.33-38
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    • 2007
  • We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

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Prevention of Oak Wilt by Tree Injection of Culture Suspension of an Antifungal Microorganism, Streptomyces blastmyceticus against Oak Wilt Fungus, Raffaelea quercus-mongolicae

  • Lee, Jin Heung;Hong, A Reum;Yun, Ji Ho;Seo, Sang Tae;Lee, Jong Kyu
    • Journal of Forest and Environmental Science
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    • v.34 no.5
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    • pp.376-381
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    • 2018
  • For the control of oak wilt caused by Raffaelea quercus-mongolicae, an antifungal microorganism, Streptomyces blastmyceticus, was used as a potential agent. Culture suspension of S. blastmyceticus was injected into Quercus mongolicae in the research forest of Kangwon National University by $ChemJet^{(R)}$ trunk injection and Macro-infusion at root flare injection. $Alamo^{(R)}$ (a.i., propiconazole 14.5%), a fungicide currently used for the control of oak wilt in USA, was also treated by both methods to compare the efficacy. For preventive efficacy, culture suspension of the pathogen was inoculated at 1 month after injection of either agent. Tested trees were cut at 3 months after treatment, stained with 1% Fuchsin acid, and then non-conductive area (NCA) and re-isolation frequency (RIF) of oak wilt fungus were compared among treatments. While NCA was the highest as 47.3% in pathogen only treatment, it was the lowest as 16.0% in sterilized water treatment by Macro-infusion. NCAs of Alamo treatment by Macro-infusion and ChemJet injection were 25.3% and 32.1%, respectively. NCA of S.blastmyceticus treatment by ChemJet injection was 32.3%, similar with Alamo treatment's by ChemJet injection. All treatments by either injection method showed significantly lower NCA compared to the pathogen only treatment. These results indicate that S. blastmyceticus injection shows the preventive efficacy against oak wilt disease by suppressing the growth of pathogen injected. NCA of Macro-infusion injection of sterilized water was lower as 16.0%, compared to 21.3% of ChemJet injection. It means that Macro-infusion is more effective in translocation of sterilized water than ChemJet injection by even distribution. RIF from wood discs of treated trees showed high in pathogen only treatment, but relatively low in S. blastmyceticus treatment. RIF results were correlated with NCA results. From the above results, it was confirmed that S. blastmyceticus showed preventive efficacy against oak wilt disease by ChemJet trunk or Macro-infusion at root flare injection.

Synthesis and Characterization of Poly(alkyl $\alpha$, L-glutamate-co-ethylene oxide)

  • Kim, Gunwoo;Kim, Jin-Yeol;Daewon Sohn;Lee, Youngil
    • Macromolecular Research
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    • v.10 no.1
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    • pp.49-52
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    • 2002
  • Rod-coil amphiphilic block copolymers, PALG-PEOs, poly(alkyl $\alpha$, L-glutamate-co-ethylene oxide)s, were successfully synthesized in three steps: 1) esterification of L-glutamic acid, 2) synthesis of ${\gamma}$-alkyl L-gultamate N-carboxyanhydride, and 3) polymerization of NCA monomers. These molecules form polymeric micelles with the hydrophobic core and hydrophilic corona in aqueous solution, which were characterized by light scattering and static fluorescence measurement.

Study of a Low-Temperature Bonding Process for a Next-Generation Flexible Display Module Using Transverse Ultrasound (횡 초음파를 이용한 차세대 플렉시블 디스플레이 모듈 저온 접합 공정 연구)

  • Ji, Myeong-Gu;Song, Chun-Sam;Kim, Joo-Hyun;Kim, Jong-Hyeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.4
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    • pp.395-403
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    • 2012
  • This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.