• Title, Summary, Keyword: Microstructures

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Direct Formation of Bi-level Microstructures for Wide-viewing Liquid Crystal Displays with Plastic Substrates

  • Hong, Jong-Ho;Cho, Seong-Min;Kim, Yeun-Tae;Lee, Sin-Doo
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.1286-1289
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    • 2008
  • We report on a wide-viewing liquid crystal (LC) display with bi-level microstructures spontaneously formed by selective wetting on a chemically heterogeneous surface. The bi-level microstructures serve as spacers for maintaining uniform cell gap, as well as protrusions for wide-viewing properties. Our LC cell having the bi-level microstructures shows good electro-optic properties.

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INTERLAYER COUPLING AND MAGNETOOPTICS IN MULTILAYERS

  • Lu, M.;Bie, Q.S.;Xu, Y.B.;Zhai, H.R.;Zhou, S.M.;Chen, Liangyao;Jin, Q.Y.
    • Journal of the Korean Magnetics Society
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    • v.5 no.5
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    • pp.561-566
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    • 1995
  • Additional magnetooptical Kerr effect (AMOKE) was observed in several multilayer structures. For Fe/Pd and Co/Cu Multilayers, AMOKE enhanced the Kerr rotation in short wavelength side, while for Fe/Ag and FeSi/Cu multilayer systems the Kerr rotation enhancement appeared in long wavelength side. A number of ferromagnetic/nonmagnetic/ferromagnetic(FM/NM/FM) sandwiches showed that the AMOKE led to oscillations of Kerr rotation and Kerr ellipticity in certain wavelength range with changing NM layer thickness similar to the oscillatory interlayer coupling. The oscillation of effective optical constants related to the MOKE oscillation was observed for the first time. The mechanisms of the AMOKE were discussed.

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Integrated 3-D Microstructures for RF Applications (Invited)

  • Euisik Yoon;Yoon, Jun-Bo;Park, Eun-Chul;Han, Chul-Hi;Kim, Choong-Ki
    • Proceedings of the IEEK Conference
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    • pp.203-207
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    • 1999
  • In this paper we report new integration technology developed for three-dimensional metallic microstructures in an arbitrary shape. We have developed the two fabrication methods: Multi-Exposure and Single-Development (MESD) and Sacrificial Metallic Mold(SMM) techniques. Three-dimensional photoresist mold can be formed by the MESD method while unlimited number of structural levels can be realized by the SMM technique. Using these two techniques we have fabricated solenoid inductors and levitated spiral inductors for RF applications. We have achieved peak Q- factors over 40 in the 2-10㎓ range, the highest number among the inductors reported to date. Finally, we propose "On-Chip Passives" as a post IC process for monolithic integration of inductors, tunable capacitors, microwave switches, transmission lines, and mixers and filters toward future single-chip transceiver integration.

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Development of a Novel Fabrication Process for Multi-layered Microstructures using a Micro Milling and Deep X-ray Lithography (마이크로 밀링과 X-선 리소그래피 공정을 이용한 다층 마이크로 구조물 제작 공정 개발)

  • Kim, Jong Hyun;Chang, Suk Sang;Lim, Geunbae
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.3
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    • pp.269-275
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    • 2014
  • Conventional machining technologies such as a milling process have limitations in accuracy to fabricate microstructures. Deep X-ray lithography using the synchrotron radiation is a promising micromachining process with an excellent accuracy, whereas there are difficulties in the fabrication of multi-layered structures. Therefore, it is mainly used for fabricating simple mono-layered microstructures with a high aspect ratio. In this study, a novel technology for fabricating multi-layered microstructures is proposed by combining two processes. In advance, an X-ray resist material is cut and machined into various shapes and heights by the micro milling process. Subsequent X-ray irradiation process facilitates the fabrication of multi-layered microstructures. The proposed technology can overcome the limitation of the pattern accuracy in conventional milling process and the difficulty of the multi-layered machining in x-ray process. The usefulness of the proposed technology is demonstrated in this study by applying the technique in the realization of various multi-layered microstructures.

Fabrication of 3D Microstructures with Single uv Lithography Step

  • Han, Man-Hee;Lee, Woon-Seob;Lee, Sung-Keun;Lee, Seung S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.2 no.4
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    • pp.268-272
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    • 2002
  • This paper presents a novel microfabrication technology of 3D microstructures with inclined/rotated UV lithography using negative photoresist, SU-8. In some cases, reflected UV as well as incident UV is used to form microstructures. Various 3D microstructures are simply fabricated such as embedded channels, bridges, V-grooves, truncated cones, and so on.