• Title, Summary, Keyword: MLCC

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MLCC 제품 개발 동향

  • Wi, Seong-Gwon
    • Ceramist
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    • v.14 no.1
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    • pp.41-45
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    • 2011
  • 지금까지 간단하게나마 MLCC 제품군별로 제품개발 요구사항과 기술개발현황을 살펴 보았다. 2008년 세계금융위기 이후 IT 분야를 중심으로 급증하고 있는 전자부품수요에 대응하기 위해 MLCC 업계는 시장선점을 위한 제품개발과 증설을 서두르고 있으며, 초고용량MLCC로 대표되는 고부가시장의 개척과 생산성향상을 통한 원가경쟁력 확보가 화두가 되고 있다. 세라믹후막기술의 구현 정도에 따라 초고용량 MLCC 개발에 필수적인 소형화 박층화기술의 발전방향이 판가름 날 것으로 보이며, 특히 기초소재가 되는 유전체재료와 나노파우더 합성기술, 그리고 이를 적용할 수 있는 제반 공정기술 및 설비 개발 등의 종합적인 전개를 통해 MLCC 시장이 지속적으로 확대 발전될 것으로 믿는다.

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Application of Response Surface Method for Optimal Transfer Conditions of MLCC Alignment System (반응표면법을 이용한 MLCC 자동 정렬 시스템의 운영조건 최적화)

  • Kim, Jae-Min;Chung, Won-Ji;Shin, O-Chul
    • Journal of The Korean Society of Manufacturing Technology Engineers
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    • v.19 no.4
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    • pp.582-588
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    • 2010
  • This paper presents the Application of Response Surface Method for Optimal Transfer Conditions of MLCC Alignment System. his paper is composed of two parts: (1) Testing performance verification of MLCC alignment system, compared with manual operation; (2) Applying response surface method to figuring out the optimal transfer conditions of MLCC transfer system. Based on the successfully developed MLCC alignment system, the optimal transfer conditions have been explored by using RSM. The simulations using $ADAMS^{(R)}$ has been performed according to the cube model of CCD. By using $MiniTAB^{(R)}$, we have established the model of response surface based on the simulation results. The optimal conditions resulted from the response optimization tool of $MiniTAB^{(R)}$ has been verified by being assigned to the prototype of MLCC alignment system.

Analysis on behavior of MLCC considering material properties for BaTiO3 (Barium Titanate 의 재료 특성을 고려한 MLCC 의 거동 분석)

  • Park, No-Cheol;Jeong, Sanggeuk;Ko, Byeong-Han;Park, Young-Pil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.69-71
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    • 2014
  • MLCCs are used broadly in electronic industry like smart phone and TV. Although they are fabricated in small size and have high capacitance, there are acoustic noise problems to reduce comfort of user. Acoustic noise results from linear piezoelectricity and nonlinear electrostriction of $BaTiO_3$ in MLCC and there are some researches on MLCC vibration under AC electric field. When only AC electric field without DC bias is applied to MLCC, fundamental frequency response is affected by piezoelectricity and second-harmonic frequency response shows electrostrictive vibration. In this study we get vibration shape of MLCC under AC electric field for each frequency and analysis on the mechanism of MLCC vibration affected by piezoelectricity and electrostriction.

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Thermally Stimulated Depolarization Current Test for Reliability of X5R MLCC (TSDC 방법을 이용한 X5R MLCC의 신뢰성 평가)

  • Park, Ji-Young;Park, Jae-Sung;Kim, Young-Tae;Hur, Kang-Heon
    • Journal of the Korean Ceramic Society
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    • v.46 no.2
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    • pp.155-160
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    • 2009
  • The reliability could be one of the essential properties for multilayer ceramic capacitor (MLCC) using in various electronic devices and the concentration and mobility of oxygen vacancy would play important role in the reliability. To investigate the migration behavior of oxygen vacancies, thermally stimulated depolarization current (TSDC) is adopted. In dielectric material of X5R MLCC, the TSD-Current peak observed around 150$^{\circ}C$ and 200$^{\circ}C$ which represented the migration of oxygen vacancy. Substituting Yttrium for Dysprosium in X5R MLCC showed higher migration activation energy and lower TSD current density.

Development of image processing based MLCC automatic inspection system (영상 처리 기반 MLCC 자동 검사 시스템 개발)

  • Seo, Ji Yoon;Park, Jun-mo;Jeong, Do-Un
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • pp.381-382
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    • 2015
  • Small devices such as MLCC, sample inspection on the processing is not easy. If you can proceed with the sample inspection, the production process will be able to maximize the MLCC production efficiency. In this study, to minimize the interference of operator, and to maximize the operating efficiency of the equipment. Use image processing techniques for its extracts the position and angle of the MLCC. Implements an automatic inspection system with the high productivity.It is possible to inspect the final six MLCC devices. And once we Pick-Up to 200 Chip to check the accuracy of 98.4%. Based on the results of various studies are in progress to be expected to be applicable to the automatic inspection equipment side development of a variety of small devices.

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Condition Monitoring in Multilayer Stacking Processes (적층 공정에서의 상태 기반 모니터링)

  • Min, Hyungcheol;Lee, Younggon;Jeong, Haedong;Park, Seungtae;Lee, Seungchul
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.739-742
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    • 2014
  • In the process of MLCC manufacturing, MLCC stacking process is the key process of making high quality MLCC. Since MLCC is small components, the entire process of MLCC stacking process is minute and sensitive to micro errors. To prevent micro error, we suggest condition-based monitoring which quantifies error based on feature extraction and quantifying error method. As results, it has been shown that the suggested algorithm has effectiveness of condition based monitoring of MLCC stacker.

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Experimental Study on the Deformation of MLCC Compressed Bar by Quantitative Analysis for Outgas (Outgas 분석을 통한 MLCC Bar 변형률 측정)

  • Kim, Min-Ju;Kim, Jong-Yun;Jeong, Gi-Ho;Park, Chang-Sik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.458-463
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    • 2010
  • MLCC (multi-layer ceramic capacitor) is usually fabricated by lamination of predetermined number of single layers. Often, the state of MLCC before sintering is called the green state, whose strength comes from the adhesion between the dielectric material and the polymer binder. Therefore the lamination of a single layer before sintering can be easily deformed by environment due to the relatively lower strength. After the compression process, which helps single sheets cohereto with adjacent sheets, the MLCC green bar is preheated to resolve the probable internal stress. Unfortunately, unexpected deformation after preheating resulted in problems during cutting of the MLCC green bar. In this study, one of 2 primary hypotheses which were proposed to resolve the unexpected deformation after preheating was examined by quantitative experiment with GC/MS (gas chromatograpy/mass spectrometer). The proportion of deformation caused by DOP evaporation, which was primarily evaporated componet during preheating, to the total deformation of the MLCC green bar was found to be 53%.

Development of Ultra-high Capacitance MLCC through Low Temperature Sintering (저온소결을 통한 초고용량 MLCC 개발)

  • Sohn, Sung-Bum;Kim, Hyo-Sub;Song, Soon-Mo;Kim, Young-Tae;Hur, Kang-Heon
    • Journal of the Korean Ceramic Society
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    • v.46 no.2
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    • pp.146-154
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    • 2009
  • It is necessary to minimize the thickness of Ni inner electrode layer and to improve the coverage of inner electrode, for the purpose of developing the ultra high-capacity multi layered ceramic capacitor (MLCC). Thus, low temperature sintering of dielectric $BaTiO_3$ ceramic should be precedently investigated. In this work, the relationship between dielectric properties of MLCC and batch condition such as mixing and milling methods was investigated in the $BaTiO_3$(BT)-Dy-Mg-Ba system with borosilicate glass as a sintering agent. In addition, several chip properties of MLCC manufactured by low temperature sintering were compared with conventionally manufactured MLCC. It was found that low temperature sintered MLCC showed better DC-bias property and lower aging rate. It was also confirmed that the thickness of Ni inner electrode layer became thinner and the coverage of inner electrode was improved through low temperature sintering.

Prediction of acoustic noise generated in pcb by MLCC (MLCC 에 의해 기판에서 발생하는 소음 분석 및 예측)

  • Park, No-Cheol;Kim, Dong-Joon;Ko, Byung-Han;Park, Young-Pil;Park, Heung-Kil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • pp.75-78
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    • 2014
  • MLCC is one of the most frequently used component in high-tech device like smart phone. Because of dynamic characteristic of piezoelectric materials which is main ingredient of MLCC, its vibration leads to acoustic noise from pcb. To solve this problem at minimal cost, company has to change only the main noise-generating MLCC to low noise-generating MLCC. To find the main noise source, this study approached to solution from a vibration point of view. From mode shapes of pcb at particular frequencies, two groups can be obtained; MLCCs soldered at where maximum deformation occurs and where anti-phase with respect to the other group appears. When the MLCC belongs to 1st group does not working, amplitude at where maximum deformation occurs decreases compared to when all MLCCs are working. This tendency also appears in noise measurement. This analysis can be put to use in various fields where require noise reduction or noise source identification.

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