• Title, Summary, Keyword: Flexible substrate

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The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump (플렉서블 기반 미세 무연솔더 범프를 이용한 칩 접합 공정 기술)

  • Kim, Min-Su;Ko, Yong-Ho;Bang, Jung-Hwan;Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.3
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    • pp.15-20
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    • 2012
  • In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

Preparation of AZO thin film on the flexible substrate (Flexible 기판을 이용한 AZO 박막제작)

  • Cho, Bum-Jin;Keum, Min-Jong;Kim, Kyung-Hwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.281-282
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    • 2005
  • The AZO thin film was prepared on flexible substrate by Facing Targets Sputtering method. The substrate used the Polycarbonate(PC), thickness 200$\mu$m. In particular, the AZO thin film was prepared at room temperature because the substrate is weak in heat. The structural, electrical, optical properties of the AZO thin film were investigated and the surface was observed by microscope.

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Characteristics of flexible indium tin oxide electrode grown by continuous roll-to-roll sputtering process for flexible displays

  • Choi, Kwang-Hyuk;Cho, Sung-Woo;Jeong, Jin-A;Kim, Han-Ki
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.605-608
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    • 2008
  • The preparation and characteristics of flexible indium tin oxide electrodes grown on polyethylene terephthalate (PET) substrates using a specially designed roll-to-roll sputtering system for use in flexible optoelectronics In spite of low a PET substrate temperature, we can obtain the flexible electrode with a sheet resistance of 47.4 ohm/square and an average optical transmittance of 83.46 % in the green region of 500~550 nm wavelength. Both x-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM) analysis results showed that all flexible ITO electrodes grown on the PET substrate were an amorphous structure with a very smooth and featureless surface, regardless of the Ar/$O_2$ flow ratio due to the low substrate temperature, which is maintained by a cooling drum. In addition, the flexible ITO electrode grown on the Ar ion beam treated PET substrates showed more stable mechanical properties than the flexible ITO electrode grown on the wet cleaned PET substrate, due to an increased adhesion between the flexible ITO and the PET substrates.

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TFD Device with Symmetrical Structure of Flexible Electrode Subject to Flexible Substrate

  • Lee, Chan-Jae;Hong, Sung-Jei;Kim, Won-Keun;Han, Jeong-In
    • Transactions on Electrical and Electronic Materials
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    • v.3 no.4
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    • pp.32-35
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    • 2002
  • In this work, we test electrode material of TFD (Thin Film Diode) device subject to flexible substrate. Al, that is ductile metal, was proper for flexible electrode to fabricate flexible display. The fabricated devices had symmetric electrode structure on both sides of insulation layer. The electrode was made of ductile Al so as to reduce the mismatch of properties between the electrode and substrate. The TFD device was successfully fabricated applying our own etch-free process. Electrical properties were improved by post-annealing.

Substrate-Assembling Technique using Adhesive Patterned Spacers for Flexible Liquid Crystal Displays

  • Kang, Jae-Hyun;Bae, Kwang-Soo;Yi, Seung-Woo;Kim, Jae-Hoon;Yu, Chang-Jae
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.218-220
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    • 2009
  • We proposed an enhanced substrate-assembling technique using adhesive patterned spacers for flexible liquid crystal displays (LCDs). The negative photoresister was used for the rigid columnar spacers and the strong substrate-bonding agent. The proposed technique is expected to be a good candidate for manufacturing method of flexible LCDs.

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Polarized OLED on a flexible optical anisotropic substrate for mobile display

  • Park, Byoung-Choo;Park, Chan-Hyuk;Kim, Mi-Na;Han, Mi-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.1523-1526
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    • 2009
  • We present highly polarized light emissions from an OLED on a flexible photonic anisotropic substrate. It was found that the polarization direction of emitted electroluminescent light corresponded to the ordinaryaxis of the photonic anisotropic substrate. Furthermore, it was also found that luminous polarized electroluminescence over 4,500 cd/$m^2$ was produced with high peak efficiency of 6 cd/A and high polarization ratio over 25.

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Ag Electrode Strain Sensor Fabrication Using Laser Direct Writing Process

  • Kim, Hyeonseok;Shin, Jaeho;Hong, Sukjoon;Ko, Seung Hwan
    • Journal of Sensor Science and Technology
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    • v.24 no.4
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    • pp.215-218
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    • 2015
  • As several innovative technologies for flexible electric devices are being realized, demand for in-situ strain monitoring for flexible electric devices is being emphasized. Because flexible devices are commonly influenced by substrate strain, suitable strain sensors for flexible devices are essential for the sophisticated maneuvering of flexible devices. In this study, a flexible strain sensor based on an Ag electrode is prepared on a polyimide substrate using the LDW (laser direct writing) process. In this process, first, the Ag nanoparticles are coated on the substrate and selectively sintered using a focused laser. Because of the advantages of the LDW process (such as being mask-less, using low temperatures, and having non-vacuum characteristics), the entire fabrication process has been dramatically simplified; as a final outcome, a highly reliable strain sensor has been fabricated. Using this strain sensor, various strain conditions that arise from different bending radii can be detected by measuring real-time electrical signals.

Design and Implementation of Nanoimprint Lithography System for Flexible Substrates (유연기판을 위한 나노임프린트리소그래피 시스템 설계)

  • Lim, Hyung-Jun;Lee, Jae-Jong;Choi, Kee-Bong;Kim, Gee-Hong;Ryu, Ji-Hyeong
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.4
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    • pp.513-520
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    • 2011
  • The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.

A Study on Properties of PVA/$SiO_2$ Organic-inorganic Hybrid Materials Barrier Layer Coated on Flexible Substrate (PEN)

  • Koo, Tae-Wook;Farva, Umme;Yu, Eric S.H.;Kim, Yun-Su;Park, Chin-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.657-659
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    • 2008
  • Barrier coating properties of PVA/$SiO_2$ on the flexible substrates (PEN) have been investigated. Thin layer of PVA/$SiO_2$ organic-inorganic hybrid materials were deposited on PEN substrate by the spin-coating. The optical properties and surface roughness of barrier layer on flexible substrate were characterized by AFM, UV-Vis and WVTR/ OTR.

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A substrate bias effect on the stability of a-Si:H TFT fabricated on a flexible metal substrate

  • Han, Chang-Wook;Nam, Woo-Jin;Kim, Chang-Dong;Kim, Ki-Yong;Kang, In-Byeong;Chung, In-Jae;Han, Min-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • pp.257-260
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    • 2007
  • Hydrogenated amorphous silicon thin film transistors were fabricated on a flexible metal substrate. A negative voltage at a floated gate can be induced by a negative substrate bias through a capacitor between the substrate and gate electrode. This can recover the shifted-threshold voltage to an original value.

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