• Title, Summary, Keyword: FR4 PCB

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The LED PKG Analysis of Thermal Resistance Characteristics by Following Via hole and FR4 PCB Area (FR4 PCB면적과 Via hole에 따른 LED PKG 열 저항 특성 분석)

  • Kim, Sung-Hyun;Joung, Young-Gi;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • pp.1724-1725
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    • 2011
  • 본 논문에서는 LED 패키지의 방열문제를 해결하기 위해 FR4 PCB에 Via-hole을 형성함으로써 열전달 능력을 향상시키고자 하였다. 또한 FR4 PCB의 면적과 Via-hole 크기 및 수량을 변화를 주어 그에 따른 K-factor를 측정 하였으며 열 저항 특성을 분석하였다. 결과로서, Via-hole을 형성한 FR4 PCB의 경우 초기 면적이 증가함에 따라 열 저항 및 접합온도가 급격히 감소하는 특성을 보였으며 200 [mm2]에서 안정화 되는 특성을 보였다. 또한 PCB 면적 및 Via-hole을 형성함에 따라 광 출력이 최대 17% 향상 되었다. 따라서 접합온도 및 열 저항에 있어서 PCB면적의 증가 및 Via-hole을 구성함에 있어 열전달 능력을 향상시킬 수 있음을 확인하였다.

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Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB (FR4 PCB의 Via-hole이 LED 패키지에 미치는 열적 특성 분석)

  • Lee, Se-Il;Lee, Seung-Min;Park, Dae-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.24 no.12
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    • pp.57-63
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    • 2010
  • The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

Analysis of Thermal Properties in LED Package by Via-hole and Dimension of FR4 PCB (FR4 PCB면적과 Via-hole이 LED패키지에 미치는 열적 특성 분석)

  • Kim, Sung-Hyun;Lee, Se-Il;Yang, Jong-Kyung;Park, Dae-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.3
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    • pp.234-239
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    • 2011
  • In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.

A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL (카본 CCL에 의한 PCB의 열전달 특성 연구)

  • Cho, Seunghyun;Jang, Junyoung;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.37-46
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    • 2015
  • In this paper, the heat transfer characteristics of PCB (Printed Circuit Board) with cabon CCL (Copper Claded Layer) were studied through experiments and numerical analysis to compare of PCBs with conventional the FR-4 core and heavy copper cores. For study, samples are producted with HDI (High Density Interconnection) PCB of mobile phone with variations of thickness of core materials and grades of carbon material to evaluate heat transfer characteristics respectively. From this research results, heat transfer characteristics of the carbon core was rather low than heavy copper, but better than FR-4 core. In addition, even though the carbon and heavy copper core contributed on the heat transfer characteristics as their thickness increases, FR-4 cores disturbed heat transfer characteristics as it's thickness increases. Therefore, carbon core is recommendable to improve the heat transfer characteristics of the PCB because heavy copper core has much disadvantages such as increasing of wear of drill, the weight of PCB, and manufacturing cost by additional insulation materials for electrical insulation.

Acceleration Test of Ion Migration in FR-4 PCB Plated with Sn (Sn 표면처리된 FR-4 재질 PCB에서의 이온마이그레이션 가속시험)

  • Hwang, Soon-Mi;Jung, Young-Baek;Kim, Chul-Hee;Lee, Kwan-Hun
    • Journal of Applied Reliability
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    • v.12 no.3
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    • pp.153-163
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    • 2012
  • Recently, as a electronic components are becoming more high-density, so that electronic circuits have smaller pitches between the leads and are more vulnerable to insulation failure. And the reliability of electric insulation has become an ever important issue as device contact pitches and print patterns shrink. Ion migration occurs in highly humid environment as voltage is applied to an installed print circuit. Under highly humid and voltage applied circumstances, electronic components respond to applied voltages by electrochemical ionization of metals, and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. In thesis, we study acceleration test of ion migration in FR-4 PCB plated with Sn. Voltage applied test of FR-4 PCB circuits plated with Sn was tested in the temperature and humidity environments. As a result of this test, equation of acceleration model was derived.

Analysis of LED Package Properties by PCB Material and Via-hole Construction (PCB 재질 및 Via hole 구성에 따른 LED 패키지의 특성 분석)

  • Lee, Se-Il;Yang, Jong-Kyung;Kim, Sung-Hyun;Lee, Seung-Min;Park, Dae-Hee
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.11
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    • pp.2038-2042
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    • 2010
  • In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

Simulation on the PCB Particle Trajectories in Corona-discharge Electrostatic Separator (코로나 방전 정전선별기 내 PCB 입자의 이동궤도 시뮬레이션)

  • Han, Seongsoo;Park, Seungsoo;Kim, Seongmin;Park, Jaikoo
    • Resources Recycling
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    • v.23 no.6
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    • pp.30-39
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    • 2014
  • The trajectories of PCB(Printed Circuit Board) particles in the corona discharge electrostatic separation was simulated. The PCB particles are prepared by crushing bare board, which disassembled from electronic components, consist mostly of copper and FR-4(Flame Retardant Level-4) Firstly, a model was established for calculating of detachment points of PCB particles from the rotating electrode in separator. The model of detachment points was derived from equilibrium of force such as gravity force, centrifugal force, electrostatic force. The trajectories of particles after detachment was calculated by acceleration derived from time-integrating method of motion equation. In this simulation, particle size, supplied voltage, rotation speed of rotating roll electrode and angle of induction electrode were adopted as variables. While the trajectories of FR-4 particles were affected by all variables, rotation speed of rotating roll electrode was dominant variables affecting trajectories of copper particles.

A Study on a Hetero-Integration of RF MEMS Switch and DC-DC Converter Using Commercial PCB Process (상용 PCB 공정을 이용한 RF MEMS 스위치와 DC-DC 컨버터의 이종 통합에 관한 연구)

  • Jang, Yeonsu;Yang, Woo-Jin;Chun, Kukjin
    • Journal of the Institute of Electronics and Information Engineers
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    • v.54 no.6
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    • pp.25-29
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    • 2017
  • This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.

The Analysis of Thermal & Optical Properties in LED Package by the PCB structure and via hole formation (PCB 구조와 via hole 구성에 따른 LED 패키지의 열적 광학적 특성 분석)

  • Lee, Se-Il;Lee, Seung-Min;Yang, Jong-Kyung;Park, Hyung-Jun;Park, Dae-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.297-298
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    • 2009
  • 대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

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A Study on Thermal Behavior and Reliability Characteristics of PCBs with a Carbon CCL (카본 CCL이 적용된 PCB의 열거동 및 신뢰성 특성 연구)

  • Cho, Seunghyun;Kim, Jeong-Cheol;Kang, Suk Won;Seong, Il;Bae, Kyung Yun
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.47-56
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    • 2015
  • In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical analysis using CAE (Computer Aided Engineering) software. For the characterization of the carbon CCL, it is compared with the conventional FR-4 core and Heavy Cu core. From research results, the deformation amount of the flexure strength of PCB is the highest with pitch grade carbon and thermal behavior of PCB is lowest as temperature increases. In addition, TC (Thermal Cycling), LLTS (Liquid-to-Liquid Thermal Shock) and Humidity tests have been applied in the PCB with carbon core and the reliability of PCB with carbon core is confirmed through reliability tests. Also, possibility of uneven surface of the via hole and wear of the drill bit due to the carbon fibers are analyzed. surface of the via hole is uniform, the surface of the drill bit is smooth. Therefore, it is proved that the carbon CCL has the drilling workability of the same level as conventional core material.