• Title, Summary, Keyword: Etching

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The Prediction of Etching Characteristics Using Monte-Carlo Simulation in Etching Process of Lead-Frame (Lead-Frame 에칭공정에서 몬테카를로 시뮬레이션을 이용한 에칭특성 예측)

  • Jeong Heung-Cheol;Choi Gyung-Min;Kim Duck-Jool
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.1
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    • pp.72-79
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    • 2006
  • The objective of this work is to simulate the etching characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, etching uniformity were investigated under different the actual operating conditions. The correlation between the etching characteristics and the spray ones were analyzed to simulate the etching characteristics in the etching process. To improve the etching characteristics in the etching process, effects of the various operating conditions such as pressure, distance from nozzle tip, pipe pitch, and feed speed should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo simulation. The etching process model was coded by Java language. It was found that the spray characteristics were correlated with the etching ones and simulation results generally agreed well with the measured results of etching characteristics in the etching process of Lead-Frame. The optimal operating parameters were successfully found under variable conditions.

A Study on Effect of Spray Characteristics on Etching Characteristics in Micro Fabrication System (미세 가공 시스템에서 분무특성이 에칭특성에 미치는 영향에 관한 연구)

  • Jung, Ji-Won;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.1
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    • pp.109-117
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    • 2004
  • The objective of this study is to investigate the effect of the spray characteristics on the etching characteristics for the optimization of etching process in the micro fabrication industry. The etching characteristics such as etching rate and etching factor were investigated under different etching conditions. To compare with the etching characteristic, the spray characteristics such as droplet size and velocity were measured by PDA system. The etching rate was increased in case of high spray pressure and in the region of spray center. The etching factor was increased with decrease in the distance from nozzle tip and increase in the etchant temperature. It was found that the spray characteristics were correlated with the etching characteristics.

The Prediction of Etching Characteristics Using Spray Characteristics in Etching Process of Lead-Frame (Lead-Frame 에칭공정에서 분무특성을 이용한 에칭특성의 예측)

  • Jeong Heung-Cheol;Choi Gyung-Min;Kim Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.30 no.4
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    • pp.381-388
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    • 2006
  • The objective of this study is to predict the etching characteristics using spray characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, uniformity were investigated on the actual operating conditions. The correlation between the etching characteristics and the spray ones obtained by measurement were analyzed to simulate the etching characteristics according to actual conditions of lead-frame etching process. These conditions of lead-frame process were spray pressure, distance from nozzle tip to substrate, pipe pitch, and nozzle pitch. To improve the etching characteristics in the lead-frame process, effects of the various operating conditions should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo method. The etching process model was coded by Java language. It was found that simulation results generally agreed well with the measured results of etching characteristics in lead-frame etching process. The optimal operating parameters were successfully found under variable conditions.

Simulation of Etching Process Using Statistical Method (통계적 기법을 이용한 에칭공정의 시뮬레이션)

  • Jeong, Heung-Cheol;Jung, Ji-Won;Choi, Gyung-Min;Kim, Duck-Jool
    • Proceedings of the KSME Conference
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    • pp.1611-1616
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    • 2004
  • The objective of this study is to simulate the etching characteristics under different process parameters for the optimization of etching process. The etching characteristics such as the etching factor were investigated under different operating conditions and compared with the spray characteristics. The spray characteristics were measured by using Phase Doppler Anemometer. The correlation between the etching characteristics and the spray characteristics was analyzed to simulate the etching characteristics under the actual parameters of the etching process. The parameters were distance of nozzle tip and pipe pitch. To improve the uniformity and value of etching factor in the etching process, the process parameters should be designed optimally. The distribution of spray was simulated by the Monte-Carlo Method and the process parameters were optimized by the design of experiments(DOE).

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Simulation of Etching Characteristics with Oscillation Angle in Etching System (에칭시스템에서 요동각 변화에 따른 에칭특성 시뮬레이션)

  • Jeong, Heung-Cheol;Kim, Young-Jin;Jung, Ji-Won;Kim, Duck-Jool
    • Proceedings of the KSME Conference
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    • pp.1534-1539
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    • 2004
  • The objective of this study is to simulate the etching characteristics with oscillation angle for the optimization of etching system. The etching characteristics were analyzed under different etching conditions. The spray characteristics were measured by Phase Doppler Anemometer (PDA). The correlation between the spray characteristics and the etching characteristics was investigated and used for fundamental data to simulate the etching characteristics with oscillation angle. The smaller coefficient of variation, the more uniform etching characteristic distribution became. It was found that numerical predictions of etching factor generally agreed well with the measured results with distance from nozzle tip. Oscillation leads to decrease of etching factor and increase of uniformity.

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A Study on Improvement of Etching Characteristics by Spray Characteristics Analysis with Nozzle Geometries in Wet Etching Process (습식 에칭공정에서 노즐 형상에 따른 분무특성 분석을 통한 에칭특성의 향상에 관한 연구)

  • Jung, Ji-Won;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.7
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    • pp.842-849
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    • 2004
  • The objective of this work is to study the improvement of etching characteristics in wet etching process. The etching characteristics such as etching factor were investigated under different etching conditions and compared with the spray characteristics. The spray characteristics of nozzle with different geometries such as swirler angle and swirl chamber aspect ratio were analyzed by using PDA system to predict the effect of the spray characteristics on the etching factor. The swirler angles were 49,5$^{\circ}$, 63$^{\circ}$ and 76.5$^{\circ}$. The swirl chamber aspect ratios were 1.2, 1.6 and 2.0. It was found that the etching factor was correlated with the spray characteristics and also the smaller swiller angle, the larger etching factor became.

The Precision of Lead Frame Etching Characteristics Using Monte-Carlo Simulations

  • Jeong, Heung-Cheol;Choi, Gyung-Min;Kim, Duck-Jool
    • International Journal of Precision Engineering and Manufacturing
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    • v.8 no.1
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    • pp.73-78
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    • 2007
  • The objective of this work was to simulate lead frame etching characteristics to optimize the etching process, Characteristics such as the etching factor and uniformity were investigated for different actual operating conditions, including pressure, distance from the nozzle tip, pipe pitch, and feed speed. The correlation between the etching and spray characteristics was analyzed to develop the etching model. Spray characteristics obtained from an experiment using a phase Doppler anemometer system were then simulated using a Monte-Carlo technique, The etching process model was coded in the Java language, The spray and etching characteristics were correlated with each other and simulated results agreed well with the measured data for a lead frame etching process, The optimal operating parameters under various conditions were successfully determined.

Correlation Between Spray Characteristics and Etching Characteristics in Twin Spray (이중분무에서 분무특성과 에칭특성의 상호상관)

  • Jung, Ji-Won;Kim, Young-Jin;Kim, Duck-Jool
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.4
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    • pp.449-455
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    • 2004
  • The objective of this study is to obtain the correlation between the spray characteristics and the etching characteristics for the optimization of etching system in the micro fabrication industry. The etching characteristics such as etching rate were measured under different conditions. The single spray characteristics such as droplet size and velocity were measured by PDA system. These were compared to the etching characteristics. The twin spray characteristics in the overlap region were analyzed to predict the effect of them on the etching characteristics with the pitch and also were compared to the single spray. The etching rate was increased in case of high spray pressure and in the region of spray center. It was found that the etching characteristics could be correlated with the single spray characteristics and the twin spray characteristics were correlated with the etching characteristics.

Characterization of via etch by enhanced reactive ion etching

  • Bae, Y.G.;Park, C.S.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.14 no.6
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    • pp.236-243
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    • 2004
  • The oxide etching process was characterized in a magnetically enhanced reactive ion etching (MERIE) reactor with a $CHF_3CF_4$ gas chemistry. A statistical experimental design plus one center point was used to characterize relationships between process factors and etch response. The etch response modeled are etch rate, etch selectivity to TiN and uniformity. Etching uniformity was improved with increasing $CF_4$ flow ratio, increasing source power, and increasing pressure depending on source power. Characterization of via etching in $CHF_3CF_4$ MERIE using neural networks was successfully executed giving to highly valuable information about etching mechanism and optimum etching condition. It was found that etching uniformity was closely related to surface polymerization, DC bias, TiN and uniformity.

A Study on the Plasma Etching of Ru Electrodes using $O_2/Cl_2$ Helicon Discharges

  • Kim, Hyoun-Woo;Hwang, Woon-Suk
    • Corrosion Science and Technology
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    • v.2 no.4
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    • pp.189-193
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    • 2003
  • The Ru etching using $O_2/C_{12}$ plasmas has been studied by employing the helicon etcher. The changes of Ru etch rate, Ru to $SiO_2$ etch selectivity and Ru electrode etching slope with varied process variables were investigated. The Ru etching slope at the optimized etching condition was measured to be $84^{\circ}$. We reveal that the Ru etching using $O_2/C_{12}$ plasma generates the $RuO_2$ thin film. Possible mechanism of Ru etching is discussed.