• Title, Summary, Keyword: Copper oxide

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Non-sintering Preparation of Copper (II) Oxide Powder for Electroplating via 2-step Chemical Reaction

  • Lee, Seung Bum;Jung, Rae Yoon;Kim, Sunhoe
    • Journal of Electrochemical Science and Technology
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    • v.8 no.2
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    • pp.146-154
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    • 2017
  • In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

Bone Regeneration Effects of Copper Oxide on Fibular Fracture in Rabbits (토끼의 비골 골절에서 산화구리(CuO, copper oxide)의 골재성 효과)

  • 정윤정;이창훈;배일주;남일;정성목;남치주;서강문
    • Journal of Veterinary Clinics
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    • v.20 no.4
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    • pp.458-466
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    • 2003
  • The bone regeneration effects of copper oxide on experimentally induced fibular fracture were examined in 36 New Zealand white male rabbits. They were divided into two groups: non-treated group (control group) and copper oxide treated group (treatment group). A fibular fracture was created by an osteotomy in the middle of the fibula and 62.5 mg/kg of copper oxide was orally administrated during 7 days after operation in the treatment group. Radiological findings, histopathological examinations and hematoserological findings were observed to evaluate the bone regeneration effects of copper oxide on fibula fracture during 9 weeks. In radiological findings, the area of bone regeneration at the fracture site of the treatment group was significantly wider from 3 weeks to 6 weeks after administration of copper oxide than those of the control group (p < 0.05). In histopathological examinations, fracture healing in treatment group was faster than in control group. Also, histopathological responses of thick bony trabeculae and new bone marrow formation were shown in the treatment group, whereas many fibrous tissues and cartilages were mainly observed in the control group. No specific effects of copper oxide on the body was found in hematological and serological test during experimental period. These results showed that the copper oxide had a potential therapeutic application in the treatment of fracture and bone trauma.

ReaxFF and Density Functional Theory Studies of Structural and Electronic Properties of Copper Oxide Clusters

  • Baek, Joo-Hyeon;Bae, Gyun-Tack
    • Journal of the Korean Chemical Society
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    • v.64 no.2
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    • pp.61-66
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    • 2020
  • In this study, we investigate the structural and electronic properties of copper oxide clusters, CunOn (n = 9 - 15). To find the lowest energy structures of copper oxide clusters, we use ReaxFF and density functional theory calculations. We calculate many initial copper oxide clusters using ReaxFF quickly. Then we calculate the lowest energy structures of copper oxide clusters using B3LYP/LANL2DZ model chemistry. We examine the atomization energies per atom, average bond angles, Bader charges, ionization potentials, and electronic affinities of copper oxide clusters. In addition, the second difference in energies is investigated for relative energies of copper oxide clusters.

A Study on Thermal Properties of Ethylene Glycol Containing Copper Oxide Nanoparticles (산화구리 나노분말을 포함하는 에틸렌글리콜 용액의 열전특성에 관한 연구)

  • Kim, Chang-Kyu;Lee, Gyoung-Ja;Rhee, Chang-Kyu
    • Journal of Korean Powder Metallurgy Institute
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    • v.17 no.4
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    • pp.276-280
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    • 2010
  • In the present work, ethylene glycol-based (EG) copper oxide nanofluids were synthesized by pulsed wire evaporation method. In order to explode the pure copper wire, high voltage of 23 kV was applied to the both ends of wire and argon/oxygen gas mixture was used as reactant gas. EG-based copper oxide nanofluids with different volume fraction were prepared by controlling explosion number of copper wire. From the transmission electron microscope (TEM) image, it was found that the copper oxide nanoparticles exhibited an average diameter about 100 nm with the oxide layer of 2~3 nm. The synthesized copper oxide consists of CuO/$Cu_2O$ phases and the Brunauer Emmett Teller (BET) surface area was estimated to be $6.86\;m^2\;g^{-1}$. From the analyses of thermal properties, it is suggested that viscosity and thermal conductivity of EG-based copper oxide nanofluids do not show temperature-dependent behavior over the range of 20 to $90^{\circ}C$. On the other hand, the viscosity and thermal conductivity of EG-based copper oxide nanofluids increase with volume fraction due to the active Brownian motion of the nanoparticles, i.e., nanoconvection.

Evolutional Transformations of Copper Nanoparticles to Copper Oxide Nanowires

  • Gang, Min-Gyu;Yun, Ho-Gyu;Kim, Yeong-Seok
    • Proceedings of the Materials Research Society of Korea Conference
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    • pp.18.2-18.2
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    • 2011
  • We study and analyze here a novel and simple approach to produce copper oxide nanowires in a methanol as an alternative to chemical synthesis routs and VLS-growth method. First, copper oxide nanowires are grown from copper nanoparticles in methanol at $60^{\circ}C$. Nanoparticles are synthesized via inert gas condensation, one of the dry processes. Synthesized nanowires were confirmed via XRD, FESEM and TEM. As a result, all particles have grown to Cu2O nanowires (20~30 nm in diameter, 5~10 um in length; aspect ratio >160~500). Next, these synthesized oxide nanowires are reduced copper nanowires in the furnace under hydrogen flow at $200{\sim}450^{\circ}C$. The evolution of oxide nanowires and their transformation to copper nanowires is studied as a function of time.

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Preparation of CuO powder for electroplating using lead frame etching wastes

  • Lee, Seung Bum;Jung, Rae Yoon;Kim, Sunhoe
    • Journal of Industrial and Engineering Chemistry
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    • v.64
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    • pp.116-123
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    • 2018
  • A novel method for manufacture of copper(II) oxide for copper electroplating solution is proposed in this paper. The copper(II) oxide was produced through two chemical reaction steps without sintering process after refinement of waste lead frame etching solution. The experimental major parameters were the amount of additives for first and second step, sodium carbonate and sodium hydroxide, respectively, to evaluate reaction characteristics. Also, the liquidity (angle of repose), solubility to sulfuric acid, chloric ion concentration and thickness of dimple thickness of plating hole were verified for the physical properties of copper(II) oxide as electroplating material. The reaction molar ratio of sodium carbonate was low, and $Cu_2CO_3$ was generated more than $Cu(OH)_2$. The optimum reaction mole ratio of sodium carbonate to copper chloride was revealed as 1.5. The optimum usage of sodium hydroxide for manufacture of copper(II) oxide using basic copper carbonate, produced at first reaction step, was 150 g. In these conditions,the average particle size of copper(II) oxide, the dissolution time for sulfuric acid, and the angle of repose were $21.49{\mu}m$, 62 s, and $35.5^{\circ}$, respectively. The yield of copper(II) oxide was 98.0 wt.%, for this optimum usage. Also, the via-filling hole thickness was $13.5{\mu}m$, which satisfies general via-filling hole thickness range, less than $15{\mu}m$.

Surface Characteristics of Copper Oxide Thin Films with Different Oxygen Ratio

  • Park, Ju-Yeon;Jo, Jun-Mo;Gang, Yong-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • pp.385-385
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    • 2010
  • Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different oxygen concentration. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was in the range of 100-400 nm. AFM images show that the surface morphology was depended on the oxygen ratio. The crystal structure of copper oxide films was changed from metallic copper to copper oxide with increasing oxygen concentration. The oxidation states of Cu 2p and O 1s resulted from XPS were consistent with XRD results.

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Effect of the Substrate Temperature on the Copper Oxide Thin Films

  • Park, Ju-Yeon;Gang, Yong-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • pp.71-71
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    • 2010
  • Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different substrate temperature. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was about 170 nm. AFM images show that the surface roughness of copper oxide films was increased with increasing substrate temperature. As the substrate temperature increased, monoclinic CuO (111) peak appeared and the crystal size decreased while the monoclinic CuO (-111) peak was independent on the substrate temperature. The oxidation states of Cu 2p and O 1s resulted from XPS were not affected on the substrate temperature. The contact angle measurement was also studied and indicated that the surface of copper oxide thin films deposited high temperature has more hydrophobic surface than that of deposited at low temperature.

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Study on Surface Morphology and Transmittance of Copper Oxide Thin Films Prepared by an Oxidation Reaction (산화반응으로 형성된 구리산화물 박막의 표면형상 및 투과율 특성에 관한 연구)

  • Lee, Eun Kyu;Park, Daesoo;Yoon, Hoi Jin;Lee, Seung-Yun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.10
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    • pp.651-655
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    • 2017
  • This work reports the surface morphology and transmittance of copper oxide thin films for semitransparent solar cell applications. We prepared the oxide specimens by subjecting copper thin films to an oxidation reaction at annealing temperatures ranging between $100^{\circ}C$ and $300^{\circ}C$. The color of the as-deposited specimen was red, but changed to purple at the annealing temperature of $300^{\circ}C$. The surface morphology and transmittance of the specimens were significantly dependent on the annealing temperature and thickness of the copper films. Copper oxide nanoparticles prepared from a 20-nm-thick copper film at an annealing temperature of $300^{\circ}C$ provided a maximum transmittance of 93%. The obtained optical characteristics and surface morphology suggest that copper oxide thin films prepared by an oxidation reaction can be potentially employed as color- and transmittance-adjusting layer in semitransparent thin solar cells.

Manufacturing of Copper(II) Oxide Powder for Electroplating from NaClO3 Type Etching Wastes

  • Hong, In Kwon;Lee, Seung Bum;Kim, Sunhoe
    • Journal of Electrochemical Science and Technology
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    • v.11 no.1
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    • pp.60-67
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    • 2020
  • In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl2 from NaClO3 type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo3·nCu(OH)2], first reaction product, CuCo3 is produced more than Cu(OH)2 when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)2 was produced more than CuCO3. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.