• Title/Summary/Keyword: Copper

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Recovery of Copper Powder from MoO3 Leaching Solution (MoO3 침출공정 폐액으로부터 동분말의 회수기술)

  • Hong, Hyun-Seon;Jung, Hang-Chul;Kim, Geun-Hong;Kong, Man-Sik
    • Journal of Korean Powder Metallurgy Institute
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    • v.16 no.5
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    • pp.351-357
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    • 2009
  • A two-step recovery method was developed to produce copper powders from copper chloride waste solution as byproducts of MoO$_3$ leaching process. The first step consisted of replacing noble copper ions with external Fe$^{3+}$ ions which were formed by dissolving iron scraps in the copper chloride waste solution. The replaced copper ions were subsequently precipitated as copper powders. The second step was cementation of entire solution mixture to separate (pure) copper powders from aqueous solution of iron chloride. Cementation process variables of temperature, time, and added amount of iron scraps were optimized by using design of experiment method and individual effects on yield and efficiency of copper powder recovery were investigated. Copper powders thus obtained from cementation process were further characterized using various analytical tools such as XRD, SEM-EDS and laser diffraction and scattering methods.Cementation process necessitated further purification of recovered copper powders and centrifugal separation method was employed, which successfully yielded copper powders of more than 99% purity and average 1$\sim$2$\mu$m in size.

Adhesion between Rubber Compound and Copper-Film-Coated Steel Plate Prepared by Vacuum Sputtering and Substitution Plating Methods (진공증착법과 치환도금법으로 제조한 구리박막 피복철판과 배합고무의 접착)

  • Moon, Kyung-Ho;Han, Min-Hyun;Seo, Gon
    • Journal of Adhesion and Interface
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    • v.4 no.3
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    • pp.1-8
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    • 2003
  • Adhesion between rubber compound and copper-film-coated steel plate (abbreviated hereafter as copper film plate) with different thicknesses of copper film was investigated. Two different methods were employed for the preparation of the copper film plates: a substitution plating of preelectroplated zinc with copper ion and a vacuum sputtering of copper on steel plate. Adhesion strength of the copper film plates with rubber compounds was largely dependent upon the thickness of copper film, regardless of their preparation methods. The copper film plates with thinner thickness than 75 nm showed high adhesion comparable to brass, while those with thicker copper film showed poor adhesion due to excessive growth of copper sulfide at adhesion interface.

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A Study on Bacterial Leaching of Low-Grade Copper Mineral(V) (저품위 동광석의 세균침출에 관한 연구 5)

  • 민봉희;박원구;이강순
    • Korean Journal of Microbiology
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    • v.12 no.1
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    • pp.25-30
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    • 1974
  • It was convinced that with a relatively small capital investment and with a low operating cost, appreciable amounts of cement copper could be produced from low-grade minerals by the application of a bacterial leaching method. For the recovery of cement copper from the impure pregnant solution, direct precipitation of copper with tin plates by a bacterial leaching method was feasible. The results obtained were as follows: 1)In order to remove the cement copper from the reducing metal, aeration and agitation method were more effective and economic than shaking method. 2)The rate of copper recovery from the pregnant solution was accerelated according to increasing quantities of reducing metal. However, the excess of reducing metal reduced the grade of cement copper. 3)Among the comparative experiments of copper recovery at each reaction temperature of $10^{\circ}C$, $20^{\circ}C$, and $30^{\circ}C$, the recovery rate of copper at $30^{\circ}C$from the pregnant solution was highest. 4)Direct cementation method on iron-containing metal was an excellent method for the recovery of cement copper in bacterial leaching.

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Studies on the Antiinflammatory Effects and the Change of Copper Content after Administration of Nonsteroidal Antiinflammatory Drugs in Rats (쥐에서 비스테로이드성 항염증제의 투여후 항염효과와 혈청 및 조직내 구리함량변화에 관한 연구)

  • 허인회;임철빈
    • YAKHAK HOEJI
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    • v.26 no.2
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    • pp.97-103
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    • 1982
  • This paper presents anti-inflammatory effects of nonsteroidal anti-inflammatory drugs and their copper complexes, and the change of content of copper in serum, liver, brain and edema foot induced by 1% carrageenan in rats, and also investigation of stomach hemorrhage. The results were as follows. 1. The content of copper decreased in liver and brain, however, the concentration of copper significantly increased in serum and edema site after carrageenan injection in rats. 2. The content of copper in serum and edema site was decreased after administration of anti-inflammatory drugs. 3. Edema inhibition rate of aspirin was, higher than that of copper (II) aspirinate, but edema inhibition rate of copper complex of naproxen was markedly higher than that of naproxen. 4. Hemorrhage of stomach of copper salicylate was higher than that of sodium salicylate, but hemorrhage of stomach of sodium naproxen was higher than that of copper naproxen.

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Non-sintering Preparation of Copper (II) Oxide Powder for Electroplating via 2-step Chemical Reaction

  • Lee, Seung Bum;Jung, Rae Yoon;Kim, Sunhoe
    • Journal of Electrochemical Science and Technology
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    • v.8 no.2
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    • pp.146-154
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    • 2017
  • In this study, copper (II) oxide was prepared for use in a copper electroplating solution. Copper chloride powder and copper (II) oxide are widely used as raw materials for electroplating. Copper (II) oxide was synthesized in this study using a two-step chemical reaction. Herein, we developed a method for the preparation of copper (II) oxide without the use of sintering. In the first step, copper carbonate was prepared without sintering, and then copper (II) oxide was synthesized without sintering using sodium hydroxide. The optimum amount of sodium hydroxide used for this process was 120 g and the optimum reaction temperature was $120^{\circ}C$ regardless of the starting material.

Synthesis, Crystal Structure and Spectroscopic Characterization of a Copper(II) Complex Coordinated by 2,2'-Dipyridylstearylamine

  • O, Yeong Hui;Kim, Ji Yeong;Park, Yeong Ja
    • Bulletin of the Korean Chemical Society
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    • v.22 no.4
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    • pp.379-382
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    • 2001
  • A new ligand containing the long aliphatic hydrocarbon chain, dipyridylstearylamine (dps) and its copper(Ⅱ) complex, Cu(dps)(NO3)2 have been prepared. The copper complex was characterized structurally and spectroscopically. The XRD crystal structure of the copper complex reveals that copper is octahedrally coordinated by dps and two nitrato ligands. The nitrato groups ligate asymmetrically to the copper. Crystal data are P1bar, a=8.249(2), b=10.416(3), $c=20.915(4)\AA$, $\alpha=86.54(2)$, $\beta=84.026(2)$, $\gamma=72.32(2)^{\circ}$, V=1702.7(7) $\AA3$ , Z=2, ${\lambda}$(Mo $K\alpha)=0.71073\AA$, $\mu=0.689$ mm-1 , T=293(2) K, R=0.0560 for 3529 reflections. The dps and the copper complex are stable in the air and the copper complex exhibits features of typical of other copper(Ⅱ) complexes containing dipyridylamine-based ligand.

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Effect of Zincate Treatment of As-Cast AZ91 Mg Alloy on Electrodeposition of Copper in a Copper Pyrophosphate Bath

  • Nguyen, Van Phuong;Park, Min-Sik;Yim, Chang Dong;You, Bong Sun;Moon, Sungmo
    • Journal of the Korean institute of surface engineering
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    • v.49 no.5
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    • pp.401-407
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    • 2016
  • In this work, effect of zincate treatment of AZ91 Mg alloy on the following electrodeposition of copper was examined in a non-cyanide bath containing pyrophosphate ions in view of surface morphology and adhesion of the electrodeposited copper layer. Without zincate treatment, the electrodeposited copper layer showed very porous structure and poor adhesion. On the other hand, the copper layer electrodeposited on the zincate-treated surface showed dense structure and good adhesion. The dissolution rate of AZ91 Mg alloy after the zincate treatment appeared to decrease about 40 times in the copper pyrophosphate bath, as compared to that of the surface without zincate treatment. The porous morphology and poor adhesion of a copper layer on the AZ91 Mg alloy surface without zincate treatment were attributed to small number of nucleation sites of copper because of rapid dissolution of the magnesium substrate in the pyrophosphate bath. Based on the experimental results, it is concluded that the zincate treatment to form a conducting and protecting layer on the AZ91 Mg alloy surface is essential for successful electrodeposition of a copper layer on AZ91 Mg alloy with good adhesion and dense structure in the copper pyrophosphate bath.

A Study on the Cu2+ Behavior in Activated Sludge Process (활성슬러지공정에서 구리의 거동에 관한 연구)

  • Park, Jin-Do;Lee, Hak-Sung
    • Journal of Environmental Science International
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    • v.19 no.9
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    • pp.1119-1127
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    • 2010
  • The behavior of copper throughout the whole process of wastewater treatment plant that uses the activated sludge process to treat the wastewater of petrochemical industry that contains low concentration of copper was investigated. Total inflow rate of wastewater that flows into the aeration tank was $697\;m^3$/day with 0.369 mg/L of copper concentration, that is, total copper influx was 257.2 g/day. The ranges of copper concentrations of the influent to the aeration tank and effluent from the one were 0.315 ~ 0.398 mg/L and 0.159 ~ 0.192 mg/L, respectively. The average removal rate of copper in the aeration tank was 50.8 %. The bioconcentration factor (BCF) of copper by microbes in the aeration tank was 3,320. The accumulated removal rate of copper throughout the activated sludge process was 71.3%, showing a high removal ratio by physical and chemical reactions in addition to biosorption by microbes. The concentration of copper in the solid dehydrated by filter press ranged from 74.8 mg/kg to 77.2 mg/kg and the concentration of copper by elution test of waste was 2.690 ~ 2.920 mg/L. It was judged that the copper concentration in dehydrated solid by bioconcentration could be managed with the control of that in the influent.

Characteristic of Flotation for Recovery of Copper from Copper Slag in Kazakhstan (카자흐스탄 구리제련소 슬래그 내 구리회수를 위한 선별 특성)

  • Park, Jayhyun;Choi, Uikyu;Choe, Hongil;Shin, Shunghan
    • Resources Recycling
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    • v.24 no.4
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    • pp.12-21
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    • 2015
  • Almost all copper slags contain a considerable amount of Cu (0.5 - 3.7%) close to or even higher than copper ores. A number of methods for metal recovery from copper slag were reported These methods can be classified into three categories, flotation, leaching and roasting. Sulfide flotation method for the recovery of copper from Kazahstan copper furnace slag is discussed in this investigation. 50% of copper from the slag was recovered by sulfide flotation at pH 4. meanwhile 67% of copper from the slag was recovered at pH 11. Higher copper recovery result at pH 11 rather than that at pH 4 was caused by the fact that copper sulfides were floated in particle size fraction over $100{\mu}m$ in concentrates at pH 11. When the slag were ground below $74{\mu}m$by ball milling, the recovery of copper by floation in slag improved to 78 - 83% because of copper liberation effect.

APPLICATION OF COLD SPRAY COATING TECHNIQUE TO AN UNDERGROUND DISPOSAL COPPER CANISTER AND ITS CORROSION PROPERTIES

  • Lee, Min-Soo;Choi, Heui-Joo;Choi, Jong-Won;Kim, Hyung-Jun
    • Nuclear Engineering and Technology
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    • v.43 no.6
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    • pp.557-566
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    • 2011
  • A cold spray coating (CSC) of copper was studied for its application to a high-level radioactive waste (HLW) disposal canister. Several copper coatings of 10 mm thick were fabricated using two kinds of copper powders with different oxygen contents, and SS 304 and nodular cast iron were used as their base metal substrates. The fabricated CSC coppers showed a high tensile strength but were brittle in comparison with conventional non-coating copper, hereinafter defined to as "commercial copper". The corrosion behavior of CSC coppers was evaluated by comparison with commercial coppers, such as extruded and forged coppers. The polarization test results showed that the corrosion potential of the CSC coppers was closely related to its purity; low-purity (i.e., high oxygen content) copper exhibited a lower corrosion potential, and high-purity copper exhibited a relatively high corrosion potential. The corrosion rate converted from the measured corrosion current was not, however, dependent on its purity: CSC copper showed a little higher rate than that of commercial copper. Immersion tests in aqueous HCl solution showed that CSC coppers were more susceptible to corrosion, i.e., they had a higher corrosion rate. However, the difference was not significant between commercial copper and high-purity CSC copper. The decrease of corrosion was observed in a humid air test presumably due to the formation of a protective passive film. In conclusion, the results of this study indicate that CSC application of copper could be a useful option for fabricating a copper HLW disposal canister.