• Title, Summary, Keyword: Ag conducting paste

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Microwave Properties of Ag Conducting Paste with Various Preparation Conditions (Ag가 함유된 전도성 도료의 제조 조건에 따른 고주파 특성)

  • Park, Sang-Hoon;Kim, Jeong-Pyo;Seong, Won-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.9
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    • pp.827-832
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    • 2005
  • Dual band internal antennas were fabricated with Ag conducting paste of various preparation conditions and different print thickness by silk screen print. We have investigated microwave properties were compared Ag conducting paste antenna with copperplate antenna at 800 MHz and 1,800 MHz. Gain of Ag conducting paste antenna was improved when preparation conditions were the single size Ag particle, using dry type resin and high Ag containing percent. However, it was lower than that of copperplate antenna within $0.1\~2.0dBi$ at 800MHz. In addition, it was improved at 800MHz when thickness of Ag conducting paste was printed more than skin depth but it was held after critical print thickness. On the other hand, it was reached level of copperplate antenna at 1,800MHz.

Characterization of Electrical Resistance for SABiT Technology-Applied PCB : Dependence of Bump Size and Fabrication Condition (SABiT 공법적용 인쇄회로기판의 은 페이스트 범프 크기 및 제작 조건에 따른 전기 저항 특성)

  • Song, Chul-Ho;Kim, Young-Hun;Lee, Sang-Min;Mok, Jee-Soo;Yang, Yong-Suk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.4
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    • pp.298-302
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    • 2010
  • We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

Filling and Wiping Properties of Silver Nano Paste in Trench Layer of Metal Mesh Type Transparent Conducting Electrode Films for Touch Screen Panel Application (실버 나노분말을 이용한 메탈메쉬용 페이스트의 충전 및 와이핑 특성)

  • Kim, Gi-Dong;Nam, Hyun-Min;Yang, Sangsun;Park, Lee-Soon;Nam, Su-Yong
    • Journal of Korean Powder Metallurgy Institute
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    • v.24 no.6
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    • pp.464-471
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    • 2017
  • A metal mesh TCE film is fabricated using a series of processes such as UV imprinting of a transparent trench pattern (with a width of $2-5{\mu}m$) onto a PET film, filling it with silver paste, wiping of the surface, and heat-curing the silver paste. In this work nanosized (40-50 nm) silver particles are synthesized and mixed with submicron (250-300 nm)-sized silver particles to prepare silver paste for the fabrication of metal mesh-type TCE films. The filling of these silver pastes into the patterned trench layer is examined using a specially designed filling machine and the rheological testing of the silver pastes. The wiping of the trench layer surface to remove any residual silver paste or particles is tested with various mixture solvents, and ethyl cellosolve acetate (ECA):DI water = 90:10 wt% is found to give the best result. The silver paste with 40-50 nm Ag:250-300 nm Ag in a 10:90 wt% mixture gives the highest electrical conductance. The metal mesh TCE film obtained with this silver paste in an optimized process exhibits a light transmittance of 90.4% and haze at 1.2%, which is suitable for TSP application.

Electrohydrodynamic Spinning of Random-Textured Silver Webs for Electrodes Embedded in Flexible Organic Solar Cells

  • Yoon, Dai Geon;Chin, Byung Doo;Bail, Robert
    • Journal of the Korean Physical Society
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    • v.70 no.6
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    • pp.598-605
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    • 2017
  • A convenient process for fabricating a transparent conducting electrode on a flexible substrate is essential for numerous low-cost optoelectronic devices, including organic solar cells (OSCs), touch sensors, and free-form lighting applications. Solution-processed metal-nanowire arrays are attractive due to their low sheet resistance and optical clarity. However, the limited conductance at wire junctions and the rough surface topology still need improvement. Here, we present a facile process of electrohydrodynamic spinning using a silver (Ag) - polymer composite paste with high viscosity. Unlike the metal-nanofiber web formed by conventional electrospinning, a relatively thick, but still invisible-to-naked eye, Ag-web random pattern was formed on a glass substrate. The process parameters such as the nozzle diameter, voltage, flow rate, standoff height, and nozzle-scanning speed, were systematically engineered. The formed random texture Ag webs were embedded in a flexible substrate by in-situ photo-polymerization, release from the glass substrate, and post-annealing. OSCs with a donor-acceptor polymeric heterojunction photoactive layer were prepared on the Ag-web-embedded flexible films with various Ag-web densities. The short-circuit current and the power conversion efficiency of an OSC with a Ag-web-embedded electrode were not as high as those of the control sample with an indium-tin-oxide electrode. However, the Ag-web textures embedded in the OSC served well as electrodes when bent (6-mm radius), showing a power conversion efficiency of 2.06% (2.72% for the flat OSC), and the electrical stability of the Ag-web-textured patterns was maintained for up to 1,000 cycles of bending.

Fabrication of Supercapacitors using Silver Nano Paste and Gel Electrolyte (은 나노 페이스트와 젤 전해질을 이용한 슈퍼캐패시터 제작)

  • Yoon, Seong Man;Jang, Hyunjung;Kim, Dae Won;Jang, Yunseok;Jo, Jeongdai;Go, Jeung Sang
    • Clean Technology
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    • v.19 no.4
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    • pp.410-415
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    • 2013
  • The supercapacitors were fabricated using silver (Ag) nano paste and activated carbon paste on the polyimide (PI) film and 5% potassium polyacrylate (PAAK) was used for gel electrolyte. In this paper, the current collector film and the electrode film were fabricated using screen printing. The thickness of printed silver paste was $7.3{\mu}m$ and the sheet resistance has the range of $5-7m{\Omega}/square$. An activated carbon with a surface area of $1,968m^2/g$, an electronic conducting agent (SUPER P, TIMCAL) and poly (4-vinylphenol) were mixed in 2-(2-buthoxyethoxy) ethyl acetate (BCA) with a ratio of 7:1:3 to fabricate the electrode paste. To analyze electrochemical characteristics, cyclic voltammetry was performed to evaluate the stability of the devices under the voltage range of -0.5-0.5 V. The calculated specific capacitances were 44.04 and 8.62 F/g for 10 and 500 mV/s scan rates, respectively.