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Study on Vibration and Thermal Characteristics Applying Staking to CCGA Package for Space Applications

우주용 CCGA에서 Staking 적용에 따른 진동 및 열 특성 연구

  • Jeong, Myung Deuk (The 3rd Research and Development Institute, Agency for Defense Development) ;
  • Jung, Sunghoon (The 3rd Research and Development Institute, Agency for Defense Development) ;
  • Hong, Young Min (PBA & Mechanical Production, LIGNex1 Co., Ltd)
  • 정명득 (국방과학연구소 제3기술연구본부) ;
  • 정성훈 (국방과학연구소 제3기술연구본부) ;
  • 홍영민 (LIG넥스원(주) 생산8팀)
  • Received : 2020.06.23
  • Accepted : 2020.09.25
  • Published : 2020.12.05

Abstract

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.