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3-Dimensional Micro Solder Ball Inspection Using LED Reflection Image

  • Kim, Jee Hong (Department of Display Engineering, Pukyong National University)
  • Received : 2019.07.03
  • Accepted : 2019.07.12
  • Published : 2019.09.30

Abstract

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

Keywords

3D Inspection;Solder Ball;BGA;Vision

Acknowledgement

Supported by : Pukyong National University

References

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