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A Study on the Weight Reduction of X,Y stage of Semiconductor Inspection Equipment using Sensitivity Analysis

민감도 분석을 이용한 반도체 검사 장비의 X, Y 스테이지 구조의 경량화 연구

  • Koh, Man Soo (Department of Mechanical Engineering, Hoseo University) ;
  • Kwon, Soon Ki (Department of Mechanical Engineering, Hoseo University) ;
  • Kim, Cham Nae (R&D Center, AURA Precision Co. Ltd.)
  • 고만수 (호서대학교 기계공학과) ;
  • 권순기 (호서대학교 기계공학과) ;
  • 김참내 (아우라프리시젼 연구소)
  • Received : 2019.04.19
  • Accepted : 2019.07.20
  • Published : 2019.07.28

Abstract

Sensitivity analysis is used to determine the effect of a change in a design parameter on the total system, and the calculated sensitivity is an important indicator of the improvement of a structure. In this study, we investigated the method of deriving and analyzing the sensitivity of design parameters by using finite element analysis and the method of improving a structure by using sensitivity analysis results. Design parameters for weight reduction design were selected using actual semiconductor inspection equipment that requires structural improvement, and the sensitivity to design parameters was calculated by using and finite difference method. We propose an improvement method that can reduce the weight while maintaining the transient response required by the equipment. By using the results of the sensitivity analysis through finite element analysis and finite difference method, we can create a structurally improved design that satisfies the desired stress or displacement by improving the design of the structure. Therefore, sensitivity analysis is applicable to various fields as well as semiconductor inspection equipment.

Keywords

Transient Response;Sensitivity Analysis;Design Variable;Finite Element Analysis;Weight Reduction

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Fig. 1. Transient Response at a Center of Camara with Comparing to the Pixel Size

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Fig. 2. Part Names and Materials of Equipment

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Fig. 3. Boundary Condition and Loading Conditions

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Fig. 4. Mode Shapes of 1st to 4th Modes

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Fig. 5. Transient Response versus time of X-axis Impact

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Fig. 6. Transient Response versus time of Y-axis Impact

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Fig. 7. Design Variables for Sensitivity Analysis

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Fig. 8. Proposed Weight Reduction Design A

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Fig. 9. Proposed Weight Reduction Design B

Table 1. Maximum Transient Response due to Impact of Moving Parts

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Table 2. Sensitivities of Design Variables

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Table 3. Weight Reduction and Maximum Displacement of Proposed Designs

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