Fig. 1. Images of (a) black and white, and (b) color CRT televisions.
Fig. 3. Structure of AMOLED displays composed of polariser, encap, organic layer, and TFT.
Fig. 5. Schematic diagrams of (a) amorphous and (b) polycrystalline silicon.
Fig. 6. Processes’ diagram for fabrication of poly-Si TFTs.
Fig. 7. Surface images of poly-Si layers after (a) SLS, (b) ELA, and (c) TDX processing.
Fig. 8. Surface images of poly-Si layers after (a) SPC, (b) MIC, (c) SGS, and (c) FALC processing.
Fig. 9. A schematic diagram showing scanning system and substrate holder inside the process chamber of nickel-sputtering system. Ions are discharged from the plasma which dislodges particles from the metal sputter target. The particles condense on the surface of the glass. The weight of the deposited nickel atom depend on the scanning speed and scanning time of nickel-target on the cathode.
Fig. 2. (a) LCD and (b) PDP televisions.
Fig. 4. (a) Loyol's FlexFai and (b) Samsung's Galaxy Fold.
Fig. 10. (a) Microscope image of long-lateral grains and (b) Brightness non-uniformity induced by oblique lines on SLS poly-Si AMOLED panel.
Fig. 11. (a) Full-color 5-inch AMOLED display shows a nonuniformity due to the different performance of TFT in the double scanned region. (b) Full-color 2.8-inch AMOLED display fabricated on the single and double scanned area for the excimer laser energy densities of 230 mJ/cm2 on solid phase crystallized silicon films.
Fig. 12. (a) Basic concept of the RPL design and diagram of the pixel circuit (2 TFTs + 1 capacitor) connection of a simple one line RPL design. (b) The RPL designed panel (b) shows a uniform green image..