# 테스트 프로브 접점 위치와 구조의 신호 전달 특성 영향

• Lee, Byung-sung (Depart. of Mechatronics Engineering, Kongju National University) ;
• Kim, Moonjung (Depart. of Electrical Electronic and Control Engineering, Kongju National University)
• 이병성 (공주대학교 기전공학과) ;
• 김문정 (공주대학교 전기전자제어공학부)
• Accepted : 2018.10.05
• Published : 2018.10.31
• 27 2

#### Abstract

This study examined the effects of the contact position and structure of the test probe on its signal transmission characteristics. The contact position in the operating of the test probe was considered and then divided into the plunger inner contact and barrel inlet contact. The high frequency performance of the test probes was investigated for both contact positions. The signal transmission characteristics of the test probes with the structures of double, single, and out-spring was also analyzed. The insertion and return losses were calculated using the HFSS and the characteristic impedance of the test probes was analyzed using a Q3D simulation. The insertion loss of the barrel inlet contact was smaller than that of the plunger inner contact. The contact position of the test probe may result in a change in the high frequency performance. The out-spring probe has better frequency characteristics at -1 dB insertion loss and -10 dB return loss. The double probe and single probe have the same characteristic impedance with $30.8{\Omega}$. On the other hand, the out-spring probe has an impedance of $47.1{\Omega}$. The out-spring probe is closer to $50{\Omega}$ than the other probes and then shows higher signal transmission characteristics. The out-spring probe has superior high-frequency characteristics and is expected to be suitable for high-speed applications.

#### Keywords

Test Probe;Signal Transmission Characteristics;Contact Position;Structure;S-parameter

#### Acknowledgement

Supported by : 한국연구재단

#### References

1. S. J. Ha, D. W. Kim, B. C. Shin, M. W. Cho, C. S. Han, "Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch", Journal of the Korea Academia-Industrial cooperation Society, Vol.11, No.4, pp.1210-1215, 2010. https://doi.org/10.5762/KAIS.2010.11.4.1210
2. H. Seo, "The Study For Measurement of Test Socket Resistance and Inductance", The Institute of Semiconductor Test of Korea, pp.1-5, 2009.
3. B. Tunaboylu, "Electrical Characterization of Test Sockets With Novel Contactors", IEEE Transactions on Device and Materials Reliability, Vol.14, No.1, pp.580-582, MARCH 2014. DOI: https://dx.doi.org/10.1109/TDMR.2012.2209888 https://doi.org/10.1109/TDMR.2012.2209888
4. C. H. Lin, H. Y. Ng, W. W. Wong, "Managing BGA test socket SI characterization", Proceedings of 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), pp.589-591, Dec. 2013. DOI: https://dx.doi.org/10.1109/EPTC.2013.6745788
5. R. B. Sun, C. Y. Wen, R. B. Wu, "A New Isolation Structure of pogo Pins for Crosstalk Reduction in a Test Socket", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.1, No.4, pp.586-594, April 2011. DOI: https://dx.doi.org/10.1109/TCPMT.2010.2102491 https://doi.org/10.1109/TCPMT.2010.2102491
6. Byeong-Woo Kim, "A study on the characteristics of wide bandwidth connector for automotive communication", Journal of the Korea Academia-Industrial cooperation Society, Vol.13, No.1, pp.33-38, 2012. https://doi.org/10.5762/KAIS.2012.13.1.33