Electrical Properties of BaTiO3-based 0603/0.1µF/0.3mm Ceramics Decoupling Capacitor for Embedding in the PCB of 10G RF Transceiver Module

  • Park, Hwa-sun (Dept. Advanced Materials Science Engineering, Sungkyunkwan University) ;
  • Na, Youngil (Dept. Advanced Materials Science Engineering, Sungkyunkwan University) ;
  • Choi, Ho Joon (Dept. Advanced Materials Science Engineering, Sungkyunkwan University) ;
  • Suh, Su-jeong (Dept. Advanced Materials Science Engineering, Sungkyunkwan University) ;
  • Baek, Dong-Hyun (Dept. of Fire & Disaster Protection Engineering at Gachon University) ;
  • Yoon, Jung-Rag (R&D Center, Samwha Capacitor)
  • Received : 2017.05.22
  • Accepted : 2018.02.05
  • Published : 2018.07.01


Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.


Embedded PCB;Decoupling capacitor;$BaTiO_3$;Dielectric properties;RF transceiver module


Grant : Development of MEMS-based ultra-thin & ultra-thin temperature / humidity / pressure convergence environment sensor

Supported by : National Research Foundation of Korea(NRF), GRRC, NST (National Research Council of Science & Technology)


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