Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Design of 1,200 V Class High Efficiency Trench Gate Field Stop IGBT with Nano Trench Gate Structure

1 um 미만의 나노트렌치 게이트 구조를 갖는 1,200 V 고효율 트렌치 게이트 필드스톱 IGBT 설계에 관한 연구

  • Kang, Ey Goo (Department of Energy IT Engineering, Far East University)
  • 강이구 (극동대학교 에너지IT공학과)
  • Received : 2018.01.30
  • Accepted : 2018.03.08
  • Published : 2018.05.01

Abstract

This paper details the design of a 1,200 V class trench gate field stop IGBT (insulated gate bipolar transistor) with a nano gate structure smaller than 1 um. Decreasing the size is important for lowering the cost and increasing the efficiency of power devices because they are high-voltage switching devices, unlike memory devices. Therefore, in this paper, we used a 2-D device and process simulations to maintain a gate width of less than 1 um, and carried out experiments to determine design and process parameters to optimize the core electrical characteristics, such as breakdown voltage and on-state voltage drop. As a result of these experiments, we obtained a wafer resistivity of $45{\Omega}{\cdot}cm$, a drift layer depth of more than 180 um, an N+ buffer resistivity of 0.08, and an N+ buffer thickness of 0.5 um, which are important for maintaining 1,200 V class IGBTs. Specially, it is more important to optimize the resistivity of the wafer than the depth of the drift layer to maintain a high breakdown voltage for these devices.

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Acknowledgement

Supported by : 한국에너지기술평가원(KETEP), 중소기업벤처부

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