A Study on the Optimal Conditions of Hole Machining of Microplate by Application of Response Surface Methodology in Wire-Pulse Electrochemical Machining

와이어 펄스전해가공에서 반응표면분석법을 응용한 미세박판의 홀 가공 최적 조건에 관한 연구

  • Song, Woo-Jae (Graduate School of Materials and Machining Process Engineering, INHA UNIV.) ;
  • Lee, Eun-Sang (School of Mechanical Engineering, INHA UNIV.)
  • 송우재 (인하대학교 대학원 재료공정공학과) ;
  • 이은상 (인하대학교 기계공학과)
  • Received : 2017.07.15
  • Accepted : 2017.09.20
  • Published : 2017.10.31


Due to the inaccuracy of micro-machining, various special processing methods have been investigated recently. Among them, pulse electrochemical machining is a promising machining method with the advantage of no residual stress and thermal deformation. Because the cross section of the wire electrode used in this study is circular, wire-pulse electrochemical machining is suitable for micro-hole machining. By applying the response surface methodology, the experimental plan was made of three factors and three levels: machining time, duty factor, and voltage. The regression equation was obtained through experiments. Then, by referring to the main effect diagram, we fixed the duty factor and machining time with little relevance, and solved the equation for the target 900 microns to obtain the voltage value. The results obtained from the response surface methodology were approximately those of the target value when the actual experiment was carried out. Therefore, it is concluded that the optimal conditions for hole processing can be obtained by the response surface methodology.


Supported by : 한국연구재단


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