The development of ultra high-speed metal film deposition system and process technology for a heat sink in digital devices

디지털 소자용 방열판 제작을 위한 초고속 금속필름 증착장치 및 공정기술 개발

  • Yoon, Hyo Eun (Department of Physics & Nano Science, Sun Moon University) ;
  • Ahn, Seong Joon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University) ;
  • Han, Dong Hwan (Department of BT-Convergent Pharmaceutical Engineering, Sun Moon University) ;
  • Ahn, Seungjoon (Division of Mechanical and ICT Convergence Engineering, Sun Moon University)
  • 윤효은 (선문대학교 나노과학과) ;
  • 안성준 (선문대학교 기계ICT융합공학부) ;
  • 한동환 (선문대학교 BT융합제약공학과) ;
  • 안승준 (선문대학교 기계ICT융합공학부)
  • Received : 2017.04.06
  • Accepted : 2017.07.07
  • Published : 2017.07.31


To resolve the problem of the temperature rise in LED or OLED lighting, until now a thick metal film has been used as a heat-sink. Conventionally, this thick metal film is made by the electroplating method and used as the heat-dissipating plate of the electronic devices. However, nowadays there is increasing need for a Cu metal film with a thickness of several hundred micrometers that can be formed by the dry deposition method. In this work, we designed and fabricated a Cu film deposition system where the heating element is separated from the ceramic crucible, which makes ultra-rapid deposition possible by preventing heat loss. In addition, the resulting induction heating also contributes to the high deposition rate. By tuning the various parameters, we obtained a $100-{\mu}m$ thick Cu film whose heat conductivity is high and whose thickness uniformity is better than 2%, while the deposition rate is as high as $1000{\AA}/s$.


Heat sink;IVD;LED;Metal film;OLED;Ultra-high speed metal deposition


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