DOI QR코드

DOI QR Code

A Study on Improvement of Optical Characteristics by Packaging Methods in Three Electrode-Type Reflective Display

3전극형 반사형 디스플레이에서 패키징 방법에 의한 광특성 개선에 관한 연구

  • Park, Sang-Hyun (Department of Electronic Engineering, Chungwoon University) ;
  • Kim, Young-Cho (Department of Electronic Engineering, Chungwoon University)
  • Received : 2016.11.09
  • Accepted : 2017.01.31
  • Published : 2017.03.01

Abstract

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

References

  1. J. S. Kim and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 25, 48 (2012). [DOI: http://dx.doi.org/10.4313/JKEM.2012.25.1.48]
  2. IRS Global, Comprehensive analysis for exploring flexible display related new business strategy. (IRS Global, Printed in Korea, 2016) p. 342.
  3. A. A Terry, Library Hi Tech, 4, 376 (2001). [DOI: http://dx.doi.org/10.1108/07378830110411925]
  4. S. S. Lee, M. Park, S. H. Lim, and J. K. Kim, J. of Industrial&Engineering Chemistry, 13, 1 (2010).
  5. C. H. Chen, F. C. Lin, Y. T. Hsu, Y. P. Huang, and H.P.D. Shieh, J. Display Technology, 5, 34 (2009). https://doi.org/10.1109/JDT.2008.2001578
  6. S. I. Lee and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 28, 2 (2015). [DOI: http://dx.doi.org/10.4313/JKEM.2015.28.2.109]
  7. D. J. Lee, Y. M. Oh, S. W. Park, B. E. Park, and Y. C. Kim, J. Disp. Technol., 8, 361 (2012) [DOI: https://doi.org/10.1109/JDT.2012.2190135] https://doi.org/10.1109/JDT.2012.2190135
  8. E. H. Song, B. H. Kang, T. Y. Kim, H. J. Lee, Y. W. Park, and Y. C. Kim, ACS Appl. Mater. Interfaces, 7, 8 4778 (2015). [DOI: https://doi.org/10.1021/am508641g]
  9. K. Y. Kwon, S. W. Kim, I. S. Hwang, and Y. C. Kim, Journal of Academia-industrial Technology, 9, 35 (2008).
  10. J. H. Choi, Y. W. Park, T. H. Park, E. H. Song, H. J. Lee, and H. K. Kim, Langmuir., 28, 6826 (2012). https://doi.org/10.1021/la300831p
  11. M. K. Kim, Y. J. Lim, S. S. Bhattacharyya, M. H. Lee, and S. H. Lee, Current Appl. Phys., 11, 7 (2011).
  12. D. J. Lee, B. E. Park, and Y. C. Kim, J. Disp. Technol., 8, 534 (2012). https://doi.org/10.1109/JDT.2012.2199280
  13. M. A. Priolo, D. Gamboa, K. M. Holder, and J. C. Grunlan, Nano. Lett., 10, 4970 (2010). https://doi.org/10.1021/nl103047k
  14. D. J. Lee and Y. C. Kim, J. Korean Inst. Electr. Electron. Mater. Eng., 21, 63 (2008).
  15. D. J. Lee and Y. C. Kim, J. Disp. Technol., 9, 972 (2013). [DOI: https://doi.org/10.1109/JDT.2013.2273125] https://doi.org/10.1109/JDT.2013.2273125