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Development of Ultra-compact LED Package and Analysis of Defect Type

극소형 LED 패키지의 개발과 불량 유형의 분석

  • Received : 2017.10.24
  • Accepted : 2017.12.20
  • Published : 2017.12.28

Abstract

This paper introduces the mold technology for the development of ultra-compact package of less than 1mm, and also analyze the error pattern of the results using this mold technology. The existing ultra-small mold structure was one-piece, which caused the surface of EDM to be rough and increase the error rate. This has been an obstacle to further reducing the size of the mold. On the other hand, the proposed mold technology tries to overcome the limitation of the one-piece type by using the prefabricated type method. This paper also classify defect patterns in the results of the proposed mold structure and analyze the occurrence probability of each pattern to use as a basic data to develop a detector.

Keywords

Ultra-compact LED package;Prefabricated molding structures;White EMC;Error pattern;Detector

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