Deposition Process Load Balancing Analysis through Improved Sequence Control using the Internet of Things

사물인터넷을 이용한 증착 공정의 개선된 순서제어의 부하 균등의 해석

  • Jo, Sung-Euy (Autoware Co., Ltd.) ;
  • Kim, Jeong-Ho (Dept. of Computer Science, Hanbat National University) ;
  • Yang, Jung-Mo (Dept. of Business Support, Korea Association of University, Research Institute and Industry)
  • Received : 2017.10.23
  • Accepted : 2017.12.20
  • Published : 2017.12.28


In this paper, four types of deposition control processes such as temperature, pressure, input/output(I/O), and gas were replaced by the Internet of Things(IoT) to analyze the data load and sequence procedure before and after the application of it. Through this analysis, we designed the load balancing in the sensing area of the deposition process by creating the sequence diagram of the deposition process. In order to do this, we were modeling of the sensor I/O according to the arrival process and derived the result of measuring the load of CPU and memory. As a result, it was confirmed that the reliability on the deposition processes were improved through performing some functions of the equipment controllers by the IoT. As confirmed through this paper, by applying the IoT to the deposition process, it is expected that the stability of the equipment will be improved by minimizing the load on the equipment controller even when the equipment is expanded.


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