Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 29 Issue 9
- /
- Pages.581-588
- /
- 2016
- /
- 1226-7945(pISSN)
- /
- 2288-3258(eISSN)
DOI QR Code
Energy Harvesting Characteristics of Interdigitated (IDT) Electrode Pattern Embedded Piezoelectric Energy Harvester
IDT 전극 패턴 임베디드 압전 에너지 하베스터의 특성
-
Lee, Min-seon
(Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Chang-Il (Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
- Yun, Ji-sun (Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
- Park, Woon Ik (Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
-
Hong, Youn-Woo
(Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
-
Paik, Jong Hoo
(Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
-
Cho, Jeong Ho
(Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology) ;
-
Park, Yong-Ho
(Department of Material Science and Engineering, Pusan University) ;
- Jang, Yong-Ho (Technology & Research Center, Senbool Corporation) ;
-
Choi, Beom-Jin
(Technology & Research Center, Senbool Corporation) ;
-
Jeong, Young-Hun
(Electronic Materials & Component Center, Korea Institute of Ceramic Engineering and Technology)
-
이민선
(한국세라믹기술원 전자소재부품센터) ;
- 김창일 (한국세라믹기술원 전자소재부품센터) ;
- 윤지선 (한국세라믹기술원 전자소재부품센터) ;
- 박운익 (한국세라믹기술원 전자소재부품센터) ;
-
홍연우
(한국세라믹기술원 전자소재부품센터) ;
-
백종후
(한국세라믹기술원 전자소재부품센터) ;
-
조정호
(한국세라믹기술원 전자소재부품센터) ;
-
박용호
(부산대학교 재료공학과) ;
- 장용호 ((주)센불 기술연구소) ;
-
최범진
((주)센불 기술연구소) ;
-
정영훈
(한국세라믹기술원 전자소재부품센터)
- Received : 2016.07.13
- Accepted : 2016.08.01
- Published : 2016.09.01
Abstract
Piezoelectric thick films of a soft
File
Acknowledgement
Supported by : 한국에너지기술평가원(KETEP)
References
- H. Shen, J. Qiu, and M. balsi, Smart Mater. Struct., 19, 115017 (2010). [DOI: http://dx.doi.org/10.1088/0964-1726/19/11/115017] https://doi.org/10.1088/0964-1726/19/11/115017
- K. B. Kim, C. I. Kim, J. S. Yun, Y. H. Jeong, J. H. Nahm, J. H. Cho, J. H. Paik S. Nahm, and T. H. Seong, J. Korean Inst. Electr. Electron. Mater. Eng., 25, 943 (2012).
- S. Pang, J. Kan, and W. Li, J. Comput. Inform. Syst., 11, 3203 (2015).
- E. Lefeuvre, A. Badel, C. Richard, and D. Guyoma, J. Intel. Mat. Syst. Str., 16, 865 (2005). [DOI: http://dx.doi.org/10.1177/1045389X05056859] https://doi.org/10.1177/1045389X05056859
- Y. Wu, A. Badel, F. Formosa, W. Liu, and A. E. Agbossou, J. Intel. Mat. Syst. Str., 24, 1445 (2013). https://doi.org/10.1177/1045389X12470307
- C. Richard, D. D. Guyomar, D. Audigier, and G. Ching, 1999 Symposium on Smart Mater. Struct., 104 (1999).
- W. Y. Hur, T. Y. Lee, K. C. Lee, H. S. Hwang, and J. T. Song. J. Korean Inst. Electr. Electron. Mater. Eng., 24, 422 (2011).
- D. Vatansever, R. L. Hadimani, T. Shah, and E. Siores, Smart Mater. Struct., 20, 055019 (2011). [DOI: http://dx.doi.org/10.1088/0964-1726/20/5/055019] https://doi.org/10.1088/0964-1726/20/5/055019
- Y. Jiang, S. Shiono, H. Hamada, T. Fujita, K. Higuchi, and K. Maenaka, Power MEMS, 375378 (2010).
- Y. Qi, J. H. Kim, T. D. Nguyen, B. Lisko, P. K. Purohit, and M. C. McAlpine, Nano Lett., 11, 1331 (2011). [DOI: http://dx.doi.org/10.1021/nl104412b] https://doi.org/10.1021/nl104412b
- B. Kumar and S. W. Kim, Nano Energy, 1, 342 (2012). [DOI: http://dx.doi.org/10.1016/j.nanoen.2012.02.001] https://doi.org/10.1016/j.nanoen.2012.02.001
- I. Mahmud, S. C. Ur, and M. S. Yoon, Electron. Mater. Lett., 10, 223 (2014). [DOI: http://dx.doi.org/10.1007/s13391-013-3060-z] https://doi.org/10.1007/s13391-013-3060-z
- R. A. Islam and S. Priya, J. Am. Ceram. Soc., 89, 3147 (2006). [DOI: http://dx.doi.org/10.1111/j.1551-2916.2006.01205.x] https://doi.org/10.1111/j.1551-2916.2006.01205.x
- I. T. Seo, Y. J. Cha, I. Y. Kang, J. H. Choi, S. Nahm, T. H. Seong, and J. H. Paik, J. Am. Cerm. Soc., 94, 3629 (2011). [DOI: http://dx.doi.org/10.1111/j.1551-2916.2011.04817.x] https://doi.org/10.1111/j.1551-2916.2011.04817.x
- R. Ly, M. Rguiti, S. D'Astorg, A. Hajjaji, C. Courtois, and A. Leriche, Sensor. Actuat. A-Phys., 168, 95 (2011). [DOI: http://dx.doi.org/10.1016/j.sna.2011.04.020] https://doi.org/10.1016/j.sna.2011.04.020
- D. Shen, J. H. Park, J. Ajitsaria, S. Y. Choe, H. C Wikle III, and D. J. Kim, J. Micromech. Microeng., 18, 055017 (2008). [DOI: http://dx.doi.org/10.1088/0960-1317/18/5/055017] https://doi.org/10.1088/0960-1317/18/5/055017
- A. Erturk and D. J. Inman, Smart Mater. Struct., 18, 025009 (2009). [DOI: http://dx.doi.org/10.1088/0964-1726/18/2/025009] https://doi.org/10.1088/0964-1726/18/2/025009
- S. Priya, IEEE Trans. Ultra. Ferro. Freq. Const., 57, 2610 (2010). [DOI: http://dx.doi.org/10.1109/TUFFC.2010.1734] https://doi.org/10.1109/TUFFC.2010.1734
- Material Data, www.piceramic.com
- D. Berlincourt and H.H.A. Krueger,\ Properties of Morgan Electro Ceramic Ceramics, www.morgan-electroceramics.com