Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 29 Issue 6
- /
- Pages.348-352
- /
- 2016
- /
- 1226-7945(pISSN)
- /
- 2288-3258(eISSN)
DOI QR Code
Properties of GaN Film Grown on AlN/PSS Template by Hydride Vapor Phase Epitaxy
AlN/PSS Template 위에 HVPE로 성장한 GaN 막의 특성
-
Son, Hoki
(Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
-
Lee, YoungJin
(Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
-
Lee, Mijai
(Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
-
Kim, Jin-Ho
(Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
- Jeon, Dae-Woo (Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
-
Hwang, Jonghee
(Optic & Display Materials Center, Korea Institute of Ceramic Engineering & Technology) ;
-
Lee, Hae-Yong
(LumiGNtech Co.)
-
손호기
(한국세라믹기술원 광.디스플레이소재센터) ;
-
이영진
(한국세라믹기술원 광.디스플레이소재센터) ;
-
이미재
(한국세라믹기술원 광.디스플레이소재센터) ;
-
김진호
(한국세라믹기술원 광.디스플레이소재센터) ;
- 전대우 (한국세라믹기술원 광.디스플레이소재센터) ;
-
황종희
(한국세라믹기술원 광.디스플레이소재센터) ;
-
이혜용
(루미지엔테크)
- Received : 2016.03.31
- Accepted : 2016.05.24
- Published : 2016.06.01
Abstract
In this paper, GaN film was grown on AlN/PSS by hydride vapor phase epitaxy compared with GaN on planar sapphire. Thin AlN layer for buffer layer was deposited on patterned sapphire substrate (PSS) by metal organic chemical vapor deposition. Surface roughness of GaN/AlN on PSS was remarkably decreased from 28.31 to 5.53 nm. Transmittance of GaN/AlN grown on PSS was lower than that of planar sapphire at entire range. XRD spectra of GaN/AlN grown on PSS corresponded the wurzite structure and c-axis oriented. The full width at half maximum (FWHM) values of
File
Acknowledgement
Supported by : 한국연구재단
References
- M. Balaji, A. Claudel, V. Fellmann, I. Gelard, E. Blanquet, R. Boichot, A. Pierret B. Attal-Tretout, A. Crisci, S. Coindeau, H. Roussel, D. Pique, K. Baskar, and M. Pons, J. Alloy. Compd., 526, 103 (2012). [DOI: http://dx.doi.orgorg/10.1016/j.jallcom.2012.02.111] https://doi.org/10.1016/j.jallcom.2012.02.111
- K. Fujita, K. Okuura, H. Miyake, K. Hiramatsu, and H. Hirayama, Phys. Status. Solidi. C, 5, 1483 (2011). [DOI: http://dx.doi.orgorg/10.1002/pssc.201001130]
- H. Hirayama, S. Fujikawa, J. Norimatsu, T. Takano, K. Tsubaki, and N. Kamata, Phys. Status. Solidi. C, S5, S356 (2009). [DOI: http://dx.doi.orgorg/10.1002/pssc.200880958]
- T. Nagashima, M. Harada, H. Yanagi, H. Fukuyama, Y. Kumagai, A. Koukitu, and K. Takada, J. Cryst. Growth, 305, 355 (2007). [DOI: http://dx.doi.orgorg/10.1016/j.jcrysgro.2007.04.001] https://doi.org/10.1016/j.jcrysgro.2007.04.001
- Y. Kumagai, Y. Enatsu, M. Ishizuki, Y. Kubota, J. Tajima, T. Nagashima, H. Murakami, K. Takada, and A. Koukitu, J. Cryst. Growth, 312, 2530 (2010). [DOI: http://dx.doi.orgorg/10.1016/j.jcrysgro.2010.04.008] https://doi.org/10.1016/j.jcrysgro.2010.04.008
- K. Fujita, K. Okuura, H. Miyake, K. Hiramatsu, and H. Hirayama, Phys. Status. Solidi. C, 8, 1483 (2011). [DOI: http://dx.doi.orgorg/10.1002/pssc.201001130] https://doi.org/10.1002/pssc.201001130
- V. Y. Davydov, Y. E. Kitaev, I. N. Goncharuk, A. N. Smirnov, J. Graul, O. Semchinova, D. Uffmann, M. B Smirnov, A. P. Mirgorodsky, and R. A. Evarestov, Phys. Rev. B, 58, 12899 (1998). [DOI: http://dx.doi.orgorg/10.1103/PhysRevB.58.12899] https://doi.org/10.1103/PhysRevB.58.12899
- W. H. Yan, L. Z. Ting, H. J. Lei, Z. L. Yi, and L. G. Qiang, Chin. Phys. B, 24, 067103 (2015). [DOI: http://dx.doi.orgorg/10.1088/1674-1056/24/6/067103] https://doi.org/10.1088/1674-1056/24/6/067103
- H. Y. Shin, Y. I. Chang, S. K. Kwon, K. T. Lee, M. J Cho, and K. H. Park, J. Korean Phys. Soc., 50, 1147 (2007). [DOI: http://dx.doi.orgorg/10.3938/jkps.50.1147] https://doi.org/10.3938/jkps.50.1147
- K. H. Chang, M. S. Kwon, and S. I. Cho, J. Institute of Industrial Technology, 12, 123 (2004).
- G. El-Zammar, W. Khalfaoui, T. Oheix, A. Yvon, E. Collard, F. Cayrel, and D. Alquier, Appl. Surf. Sci., 355, 1044 (2015). [DOI: http://dx.doi.orgorg/10.1016/j.apsusc.2015.07.201] https://doi.org/10.1016/j.apsusc.2015.07.201
- S. R. Xu, P. X. Li, J. C. Zhang, T. Jiang, J. J. Ma, Z. Y. Lin, and Y. Hao, J. Alloy. Comp., 614, 360 (2014). [DOI: http://dx.doi.orgorg/10.1016/j.jallcom.2014.06.113] https://doi.org/10.1016/j.jallcom.2014.06.113
- M. Alevil, C. Ozgit, I. Donmez, and N. Biyikli, J. Vac. Sci. Technol A, 30, 021506 (2012). [DOI: http://dx.doi.orgorg/10.1116/1.3687937] https://doi.org/10.1116/1.3687937
- C. Nootz, A. Schulte, and L. Chernyak, Appl. Phys. Lett., 80, 1355 (2002). [DOI: http://dx.doi.orgorg/10.1063/1.1449523] https://doi.org/10.1063/1.1449523
- D. G. Zhao, S. J. Xu, M. H. Xie, and S. Y. Tong, Appl. Phys. Lett., 83, 28 (2003).