Comparison of the Power Consumption between the Ceramic and Wire Bonding Packaging Methods for Solid State Electrochemical Carbon dioxide Sensors

  • Kim, Tae Wan ;
  • Park, Chong-Ook
  • Received : 2016.05.20
  • Accepted : 2016.05.30
  • Published : 2016.05.31


Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.


$CO_2$ sensor;Packaging;Gas sensor;Sensitivity;Power consumption


  1. C. O. Park, S. A. Akbar, and W. Weppner, "Ceramic electrolytes and electrochemical sensors", Journal of Mate-rials Science, Vol. 38, pp. 4639-4660, 2003
  2. C. O. Park and S. A. Akbar, "Chemical sensors for pollution monitoring and control", Journal of Materials Science, Vol. 38, pp. 4237, 2003
  3. G.S. Chung and J.M. Jeong, "Fabrication of micro heaters on polycrystalline 3C-SiC suspended membranes for gas sensors and their characteristics", Microelectronic Engineering, Vol. 87, pp. 2348-2352, 2010
  4. H. J. Han, T. W. Kim, K. M. Park, and C. O. Park, "Carbon dioxide sensor substrate for surface mounted packaging", Journal of sensor science and technology, Vol. 24, No. 3, pp. 159-164, 2015
  5. C.O Park, S.A Akbar, and J Hwang, "Selective gas detection with catalytic filter", Materials Chemistry and Physics, Vol. 75, pp. 56-60, 2002


Supported by : Amotech Corporation