Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 29 Issue 12
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- Pages.796-802
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- 2016
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- 1226-7945(pISSN)
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- 2288-3258(eISSN)
DOI QR Code
Mechanical Properties of Epoxy Alumina Multi-Composites
에폭시 알루미나 멀티-콤포지트의 기계적 특성연구
- Park, Jae-Jun (Department of Electrical Elecrtonic Engineering, Joongbu University)
- 박재준 (중부대학교 전기전자공학과)
- Received : 2016.10.15
- Accepted : 2016.11.23
- Published : 2016.12.01
Abstract
In order to develop an electrical insulation material for gas GIS (insulation switch gear) spacer, 4 types of epoxy/micro-alumina (40, 50, 60, 70 wt%) composites and 9 types of epoxy/nano-alumina (1, 3, 5 g)/micro-alumina (40, 50, 60, 70 wt%) composites were prepared and tensile test was carried out. In here, nano-alumina was previously surface-treated with GDE (glycerol diglycidyl ether). As micro-alumina and GDE-treated nano-alumina contents increased, tensile strength increased and the highest value was shown in the system with 3 g GDE-treated nano-alumina.
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References
- T. W. Dakin, IEEE Transaction on Dielectrics and Electrical Insulation, EI-9, 121 (1974). [DOI: https://doi.org/10.1109/TEI.1974.299321] https://doi.org/10.1109/TEI.1974.299321
- J. Sato, O. Sakaguchi, N. Kubota, S. Makishima, S. Kinoshita, T. Shioiri, T. Yoshida, M. Miyagawa, M. Homma, and E. Kaneko, Proc. Transmission and Distribution Conference and Exhibition Asia Pacific (Yokohama, Japan, 2002) p.1791. [DOI: https://doi.org/10.1109/TDC. 2002.1177727] https://doi.org/10.1109/TDC.2002.1177727
- T. Imai, F. Sawa, T. Nakano, T. Ozaki, T. Shimizu, M. Kozako, and T. Tanaka, IEEE Conf. Electr. Insul. Dielectr., 13, 319 (2006). [DOI: https://doi.org/10.1109/TDEI.2006.1624276] https://doi.org/10.1109/TDEI.2006.1624276
- T. Imai, F. Sawa, T. Yoshimitsu, T. Ozaki, and T. Shimizu, IEEE Conf. Electr. Insul. Dielectr. Phenomena (CEIDP), 402 (2004).
- J. J. Park, Trans. KIEE., 65 (2016).
- T. Tanaka, M. Kozako, N. Fuse, and Y. Ohki, IEEE Transaction on Dielectrics and Electrical Insulation, 12, 669 (2005). [DOI: https://doi.org/10.1109/TDEI.2005.1511092] https://doi.org/10.1109/TDEI.2005.1511092
- G. Tsagaropoulos and A. Eisenberg, Macromolecules, 28, 6067 (1995). [DOI: https://doi.org/10.1021/ma00122a011] https://doi.org/10.1021/ma00122a011
- Z. Farhadinejad, M. Ehsani, S. Moemenbellah, S.M.B. Alavi, M.M.S. Shirazi, and H. Borsi, IEEE Transactions on Nanotechnology, 11, 957 (2012). [DOI: https://doi.org/10.1109/TNANO.2012.2209458] https://doi.org/10.1109/TNANO.2012.2209458
- R. Sarathi, R. K. Sahu, and P. Rajeshkumar, Mater. Sci. Eng. A, 445, 567 (2007). [DOI: https://doi.org/10.1016/j.msea.2006.09.077] https://doi.org/10.1016/j.msea.2006.09.077
- H. Shi, N. Gao, H. Jin, and C. Wang, Mater. Sci. Forum, 658, 463 (2010). [DOI: https://doi.org/10.4028/www.scientific.net/MSF.658.463] https://doi.org/10.4028/www.scientific.net/MSF.658.463
- A. Omrani, L. C. Simon, and A. A. Rostami, Mat. Chem. Phys., 114, 145 (2009). [DOI: https://doi.org/10.1016/j.matchemphys.2008.08.090] https://doi.org/10.1016/j.matchemphys.2008.08.090
- Z. Ahmad, M. P. Ansell, and D. Smedley, Int. J. Eng. Technol., 10, 32 (2010).
- S. A. Meguid and Y. Sun, Mater. Design, 25, 289 (2004). [DOI: https://doi.org/10.1016/j.matdes.2003.10.018] https://doi.org/10.1016/j.matdes.2003.10.018
- R. R. Patel and N. Gupta, Proc. 15th Nat. Power Syst. Conf. (Mumbai, India, 2008) p. 361.
- Q. Wang, G. Chen, and A. S. Alghamdi, Proc. 10th IEEE Int. Conf. Solid Dielectr. (Potsdam, Germany, 2010) p. 263.