Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)
- Volume 29 Issue 1
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- Pages.50-57
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- 2016
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- 1226-7945(pISSN)
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- 2288-3258(eISSN)
DOI QR Code
Partial Discharge Characteristics of XLPE According to Electrode Shape and Void
전극형상 및 보이드에 따른 XLPE의 부분방전 특성
- Shin, Jong-Yeol (Department of Car-Mechatronics, Sahmyook University) ;
- Kim, Guin-sik (Department of Electrical Engineering, Kwangwoon University) ;
- Hong, Jin-Woong (Department of Electrical Engineering, Kwangwoon University)
- Received : 2015.12.16
- Accepted : 2015.12.24
- Published : 2016.01.01
Abstract
Transmission equipment is mainly used for the XLPE (cross-linked polyethylene) insulation cable for ultra high voltage power to minimize power loss. The experiment examined the partial discharge characteristics according to the insertion of the bar electrode and needle electrode into the XLPE specimen and the air voids. XLPE insulation cable manufactured by T. company and tungsten electrode material by K. company were used for specimens, by adhering conductive tape on the semi-conductive material of the lower electrode of XLPE specimen with the dimension of
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References
- K. lida, J. S. Kim, S. Nakamura, and G. Sawa, IEEE Trans. Electr. Insul., 27, 301 (1992).
- S. S. Bamji, A. T. Bulinski, and R. J. Densley, IEEE Trans. on Electrical Insulation, EI-21 (1986).
- R. M. Hill and A. K. Jonscher, Comtemp. Poly., 24, 77 (1983).
- M. R. Wertheimer, L. Paquin, H. P. Schreiber, and S. A. Boggs, IEEE Conference Record of IEEE Symposium on Electrical Insulation (1976).
- K. Yahagi, IEEE Trans. on Elect. Insul., EI-15, 241 (1980). https://doi.org/10.1109/TEI.1980.298316
- F. W. Billneyer, Textbook of Polymer Science (Inter. Sci. Pub., John Wiley and Son, New York, 1980). p. 141.
- M. Ieda, G. Sawa, and S. Kato, J. of Appl. Phys., 3737 (1971). [DOI: http://dx.doi.org/10.1063/1.1659678] https://doi.org/10.1063/1.1659678
- T. Tanaka, G. C. Montanari, and R. Mulhaupt, IEEE Transactions on Dielectric and Electrical Insulation, 11, 763 (2004). [DOI: http://dx.doi.org/10.1109/TDEI.2004.1349782] https://doi.org/10.1109/TDEI.2004.1349782
- S. Singha and M. J. Thomas, IEEE Transactions on Dielectric and Elecrical Insulation, 15, 12 (2008). [DOI: http://dx.doi.org/10.1109/T-DEI.2008.4446732] https://doi.org/10.1109/T-DEI.2008.4446732
- S. Masuda, S. Okuzumi, R. Kurniant, Y. Murakami, M. Nagao, Y. Murata, and Y. Sekiguchi, IEEE, 2007 Annual Report Conference on Electrical Insulation and Dielectric, 290 (2007).
- J. Y. Shin, H. D. Park, J. Y. Lee, and J. W. Hong, Trans. Electr. Electron. Mater., 11, 42 (2010). [DOI: http://dx.doi.org/10.4313/TEEM.2010.11.1.042] https://doi.org/10.4313/TEEM.2010.11.1.042