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A Study on Improvement of Valuable Metals Leaching and Distribution Characteristics on Waste PCBs(Printed Circuit Boards) by Using Pulverization Process

폐 PCBs의 미분쇄 공정 적용에 따른 유가금속 분포 특성 및 금속 침출 향상에 관한 연구

  • Han, Young-Rip (Department of Environmental Engineering, Dong-A University) ;
  • Choi, Young-Ik (Department of Environmental Engineering, Dong-A University)
  • Received : 2015.01.02
  • Accepted : 2015.02.13
  • Published : 2015.02.27

Abstract

The main objective of this study is to recovery valuable metals with metal particle size distributions in waste cell phone PCBs(Printed Circuit Boards) by means of pulverization and nitric acid process. The particle size classifier also was evaluated by specific metal contents. The PCBs were pulverized by a fine pulverizer. The particle sizes were classified by 5 different sizes which were PcS1(0.2 mm below), PcS2(0.20~0.51 mm), PcS3(0.51~1.09 mm), PcS4(1.09~2.00 mm) and PcS5(2.00 mm above). Non-magnetic metals in the grinding particles were separated by a hand magnetic. And then, Cu, Co and Ni were separated by 3M nitric acid. Particle diameter of PCBs were 0.388~0.402 mm after the fine pulverizer. The sorting coefficient were 0.403~0.481. The highest metal content in PcS1. And the bigger particle diameter, the lower the valuable metals exist. The recovery rate of the valuable metals increases in smaller particle diameter with same leaching conditions. For further work, it could improve to recovery of the valuable metals effectively by means of individual treatment, multistage leaching and different leaching solvents.

Acknowledgement

Supported by : 동아대학교

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