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Structure and Fatigue Analyses of the Inspection Equipment Frame of a Semiconductor Test Handler Picker

반도체 테스트 핸들러 픽커 검사장비 프레임에 대한 구조 및 피로해석

  • Kim, Young-Choon (Division of Mechanical & Automotive Engineering, Kongju University) ;
  • Kim, Young-Jin (Testopia Co. Ltd.) ;
  • Kook, Jeong-Han (School of Mechanical Engineering, Korea University of Technology and Education) ;
  • Cho, Jae-Ung (Division of Mechanical & Automotive Engineering, Kongju University)
  • 김영춘 (공주대학교 기계자동차공학부) ;
  • 김영진 (테스토피아(주)) ;
  • 국정한 (한국기술교육대학교 기계공학부) ;
  • 조재웅 (공주대학교 기계자동차공학부)
  • Received : 2014.07.23
  • Accepted : 2014.10.10
  • Published : 2014.10.31

Abstract

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

Keywords

Semiconductor test handler picker;Inspection equipment frame;Nonuniform fatigue loads;Durability;Fatigue damage

Acknowledgement

Supported by : 한국산업단지공단

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