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Optimum Condition of Micro Fuse Fusing as a Function Changed Thickness of Thermosetting Ink Epoxy

열경화성 잉크 에폭시의 두께 변화에 따른 마이크로 퓨즈 용단의 최적 조건

  • Kim, Do-Kyeong (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Hwang, Neung-Hwan (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Kil, Tae-Hong (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Lee, Soo-Hwa (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Seo, Dae-Man (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Kim, Min-Ho (Department of Technical and Research, SM HI-TECH Co., Ltd.) ;
  • Kim, Jong-Sick (Department of Technical and Research, SM HI-TECH Co., Ltd.)
  • 김도경 ((주)에스엠 하이테크 기술연구소) ;
  • 황능환 ((주)에스엠 하이테크 기술연구소) ;
  • 길태홍 ((주)에스엠 하이테크 기술연구소) ;
  • 이수화 ((주)에스엠 하이테크 기술연구소) ;
  • 서대만 ((주)에스엠 하이테크 기술연구소) ;
  • 김민호 ((주)에스엠 하이테크 기술연구소) ;
  • 김종식 ((주)에스엠 하이테크 기술연구소)
  • Received : 2014.09.01
  • Accepted : 2014.09.24
  • Published : 2014.10.01

Abstract

For the semiconductor device safety from over current in the digital electronic circuit system must be surely designed that it's surface mount type micro fuse device. In this paper, We has analysed to the fusing character of micro fuse as a function changed thickness of thermosetting ink epoxy. To the change of thermosetting ink epoxy thickness with in production lot, in the electrically character (fusing test in the 2 multiple over current and 10 multiple over current, surface temperature test in the 1.25 multiple over current) of micro fuse has been tested. According to the electrically character result, changed thickness of thermosetting ink epoxy in designed micro fuse withheld direct effect in both end resistance changes. Also, because high thermal energy in the micro fuse test of over current was occurred to effect such as thermal runaway and explosion. Therefore, screen printing process in the design of micro fuse using thermosetting ink epoxy is very important for production quality improvement.

References

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