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Difference Across Indutries of Innovation Appropriability Mechanism's Effectiveness and Classification

기술혁신 보상확보 메커니즘 효과성의 산업별 차이와 유형

  • 박성택 (충북대학교 경영정보학과 BK21 플러스 사업팀) ;
  • 김영기 (충북대학교 경영정보학과)
  • Received : 2014.03.20
  • Accepted : 2014.06.20
  • Published : 2014.06.28

Abstract

In devising technological innovation strategies and implementing successful technological innovation, some of the most important factors may be to determine whether to protect technological innovation and to choose how to protect it. Traditionally, technological innovation has been emphasized to obtain compensation as much as possible for innovation in terms of economics and strategy. However, it can be regarded as a very complicated problem to determine such a protection and its level. Generally speaking, enterprises have some common mechanisms to secure compensation for technological innovation, which are known to be patents, secrecy and lead time advantage. From the standpoint of enterprises, it is very important what strategies should be devised to secure profits for technological innovation. According to some domestic and oversea research results revealed that specific patents are not the best way to Appropriability for technological innovation, while also implying that there exist several different kinds of mechanisms to Appropriability for technological innovation in each industry. Nevertheless, since it shouldn't be ignored that most of the researches have overlooked the characteristics of Korean enterprises and industrial differences, this study intends to clarify the effectiveness of technological innovation Appropriability mechanisms reflecting actual circumstances and industrial characteristics in Korea while classifying them. Also The questionnaires and delphi method used in this study. As the result of analysis, in the entire industries, the priorities turned out to be in the order of Superior sales and service efforts, Leadtime advantage, Complementary manufacturing.

Keywords

Appropriability Mechanism;Innovation;Industry;Patent;R&D

Acknowledgement

Supported by : 한국연구재단

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