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Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions

Bendable 임베디드 전자모듈의 손상 메커니즘

  • Jo, Yun-Seong (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Kim, A Young (Components & Materials Physics Research Center, Korea Electronics Technology Institute) ;
  • Hong, Won Sik (Components & Materials Physics Research Center, Korea Electronics Technology Institute)
  • 조윤성 (전자부품연구원 부품소재물리연구센터) ;
  • 김아영 (전자부품연구원 부품소재물리연구센터) ;
  • 홍원식 (전자부품연구원 부품소재물리연구센터)
  • Received : 2013.09.17
  • Accepted : 2013.10.07
  • Published : 2013.10.31

Abstract

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Acknowledgement

Supported by : 지식경제부

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